ZHCSLL7C october 2021 – august 2023 TRF1208
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- RPV|12
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
5 Pin Configuration and Functions
Figure 5-1 RPV Package,12-Pin WQFN-FCRLF
(Top View)
Table 5-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| GND | 1, 4, 7, 10 | GND | Ground |
| INM | 5 | I | Differential signal input, negative |
| INP | 6 | I | Differential signal input, positive |
| OUTM | 12 | O | Differential signal output, negative |
| OUTP | 11 | O | Differential signal output, positive |
| PD | 2 | I | Power-down signal. Supports
1.8-V and 3.3-V Logic. 0 = Chip enabled 1 = Power down |
| TP1 | 8 | — | Test pin. Short to ground. |
| TP2 | 3 | — | Test pin. Short to ground. |
| VDD | 9 | P | 3.3-V supply |
| Thermal pad | Pad | — | Thermal pad. Connect to ground on board. |
(1) I = input, O = output, P = power, GND = ground