SLUSFQ5 September 2025 UCC33421
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | UNIT | ||
|---|---|---|---|
| DHA SOIC | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 61.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 5.88 | °C/W |
| RθJB | Junction-to-board thermal resistance | 22.2 | °C/W |
| ΨJA | Junction-to-ambient characterization parameter | 59.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 5.8 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 23.6 | °C/W |