TS3A27518E-Q1

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Product details

Protocols Analog, SPI Configuration 2:1 SPDT Number of channels 6 Bandwidth (MHz) 240 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 1.65 Ron (typ) (mΩ) 4400 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (μA) 0.01 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 105 ESD CDM (kV) 0.75 Input/output continuous current (max) (mA) 50 COFF (typ) (pF) 13 CON (typ) (pF) 21.5 OFF-state leakage current (max) (μA) 7 Ron (max) (mΩ) 16300 VIH (min) (V) 1 VIL (max) (V) 0.65 Rating Automotive
Protocols Analog, SPI Configuration 2:1 SPDT Number of channels 6 Bandwidth (MHz) 240 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 1.65 Ron (typ) (mΩ) 4400 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (μA) 0.01 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 105 ESD CDM (kV) 0.75 Input/output continuous current (max) (mA) 50 COFF (typ) (pF) 13 CON (typ) (pF) 21.5 OFF-state leakage current (max) (μA) 7 Ron (max) (mΩ) 16300 VIH (min) (V) 1 VIL (max) (V) 0.65 Rating Automotive
TSSOP (PW) 24 49.92 mm2 7.8 x 6.4 WQFN (RTW) 24 16 mm2 4 x 4
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to 105°C ambient operating temperature range
    • Device HBM ESD classification level H2
    • Device CDM ESD classification level C3B
  • Functional Safety-Capable
  • 1.65-V to 3.6-V single-supply operation
  • Powered-off protection (isolation in powerdown mode, Hi-Z when V+ = 0)
  • Low capacitance switches, 21.5 pF (typical)
  • Bandwidth up to 240 MHz for high-speed rail-to-rail signal handling
  • Crosstalk and off isolation of ?62 dB
  • 1.8-V logic threshold compatibility for control inputs
  • 3.6-V tolerant control inputs
  • ESD performance: NC/NO ports
    • ±6-kV contact discharge (IEC 61000-4-2)
  • 24-pin TSSOP (7.80 mm × 4.40 mm) and 24-pin QFN (4.00 mm × 4.00 mm) package
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to 105°C ambient operating temperature range
    • Device HBM ESD classification level H2
    • Device CDM ESD classification level C3B
  • Functional Safety-Capable
  • 1.65-V to 3.6-V single-supply operation
  • Powered-off protection (isolation in powerdown mode, Hi-Z when V+ = 0)
  • Low capacitance switches, 21.5 pF (typical)
  • Bandwidth up to 240 MHz for high-speed rail-to-rail signal handling
  • Crosstalk and off isolation of ?62 dB
  • 1.8-V logic threshold compatibility for control inputs
  • 3.6-V tolerant control inputs
  • ESD performance: NC/NO ports
    • ±6-kV contact discharge (IEC 61000-4-2)
  • 24-pin TSSOP (7.80 mm × 4.40 mm) and 24-pin QFN (4.00 mm × 4.00 mm) package

The TS3A27518E-Q1 is a 6-bit 1-of-2 multiplexer-demultiplexer designed to operate from 1.65 V to 3.6 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction. The TS3A27518E-Q1 has two control pins, each controlling three 1-of-2 muxes at the same time, and an enable pin that is used to put all outputs in high-impedance mode. The control pins are compatible with 1.8-V logic thresholds and are backward compatible with 2.5-V and 3.3-V logic thresholds as well.

The TS3A27518E-Q1 allows any SD, SDIO, and multimedia card host controllers to be expanded out to multiple cards or peripherals because the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. The TS3A27518E-Q1 has two control pins that give additional flexibility to the user, for example, the ability to mux two different audio-video signals in equipment such as an LCD television, an LCD monitor, or a notebook docking station.

The TS3A27518E-Q1 is a 6-bit 1-of-2 multiplexer-demultiplexer designed to operate from 1.65 V to 3.6 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction. The TS3A27518E-Q1 has two control pins, each controlling three 1-of-2 muxes at the same time, and an enable pin that is used to put all outputs in high-impedance mode. The control pins are compatible with 1.8-V logic thresholds and are backward compatible with 2.5-V and 3.3-V logic thresholds as well.

The TS3A27518E-Q1 allows any SD, SDIO, and multimedia card host controllers to be expanded out to multiple cards or peripherals because the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. The TS3A27518E-Q1 has two control pins that give additional flexibility to the user, for example, the ability to mux two different audio-video signals in equipment such as an LCD television, an LCD monitor, or a notebook docking station.
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Technical documentation

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* Data sheet TS3A27518E-Q1 6-bit, 1-of-2 Multiplexer or Demultiplexer With Integrated IEC L-4 ESD and 1.8-V Logic Compatible Control Inputs datasheet (Rev. D) PDF | HTML 03 Oct 2022
Product overview How to Communicate I2S Signals Between MCU, DSPs, & Amplifiers Using Multiplexer (Rev. A) PDF | HTML 23 Jun 2023
Functional safety information TS3A27518E-Q1 Functional Safety FIT Rate, FMD and Pin FMA PDF | HTML 28 Sep 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
Application brief Enabling SPI-Based Flash Memory Expansion by Using Multiplexers (Rev. B) PDF | HTML 07 Oct 2021
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML 06 Jan 2021
More literature Automotive Logic Devices Brochure 27 Aug 2014
Application note Preventing Excess Power Consumption on Analog Switches 03 Jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
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Simulation model

HSPICE Model for TS3A27518

SCDM129.ZIP (126 KB) - HSpice Model
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Simulation model

TS3A27518 IBIS Model

SCDM128.ZIP (101 KB) - IBIS Model
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Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 24 Ultra Librarian
WQFN (RTW) 24 Ultra Librarian

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