ZHCSRG2G May 2001 – December 2022 BQ2057C , BQ2057W
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | BQ2057xSN or BQ2057xTS | BQ2057xDGK MSOP | UNIT | |
|---|---|---|---|---|
| SOIC (SN) or TSSOP (TS) PACKAGE | DGK PACKAGE | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 157.1 | 121.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 46.5 | 58.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 89.6 | 65.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.3 | 12.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 87.4 | 65.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | NA | NA | °C/W |