9.2.3.1 Power Up REGN Regulation (LDO)

The REGN LDO supplies internal bias circuits as well as the HSFET and LSFET gate drive. The LDO also provides bias rail to TS external resistors. The pull-up rail of STAT and PG can be connected to REGN as well. The REGN is enabled when all the below conditions are valid.

1. VBUS above V_{VBUS_UVLOZ}
2. VBUS above V_BAT + V_SLEEPZ in buck mode or VBUS below V_BAT + V_SLEEP in boost mode
3. After 220 ms delay is completed

If one of the above conditions is not valid, the device is in high impedance mode (HIZ) with REGN LDO off. The device draws less than I_{VBUS_HIZ} from VBUS during HIZ state. The battery powers up the system when the device is in HIZ.

9.2.3.2 Poor Source Qualification

After REGN LDO powers up, the device checks the current capability of the input source. The input source has to meet the following requirements in order to start the buck converter.

1. VBUS voltage below V_ACOV
2. VBUS voltage above V_VBUSMIN when pulling I_BADSRC (typical 30mA)

Once the input source passes all the conditions above, the status register bit VBUS_GD is set high and the INT pin is pulsed to signal to the host. If the device fails the poor source detection, it repeats poor source qualification every 2 seconds.

9.2.3.3 Input Source Type Detection

After the VBUS_GD bit is set and REGN LDO is powered, the charger device runs Input Source Type Detection when AUTO_DPDM_EN bit is set.

The bq25898D follows the USB Battery Charging Specification 1.2 (BC1.2) and to detect input source (SDP/CDP/DCP) and non-standard adapter through USB D+/D- lines. In addition, when USB DCP is detected, it initiates adjustable high voltage adapter handshake on D+/D-. The device supports MaxCharge™ handshake when MAXC_EN or HVDCP_EN is set. The bq25898 sets input current limit through PSEL and OTG pins.

After input source type detection, an INT pulse is asserted to the host. In addition, the following registers and pin are changed:

1. Input Current Limit (IINLIM) register is changed to set current limit
2. PG_STAT bit is set
3. PG pin goes low (bq25898)

The host can over-write IINLIM register to change the input current limit if needed. The charger input current is always limited by the lower of IINLIM register or ILIM pin at all-time regardless of Input Current Optimizer (ICO) is enable or disabled.

When AUTO_DPDM_EN is disabled, the Input Source Type Detection is bypassed. The Input Current Limit (IINLIM) register, VBUS_STAT, and SPD_STAT bits are unchanged from previous values.

9.2.3.3.1 D+/D– Detection Sets Input Current Limit (bq25898D)

The bq25898D contains a D+/D– based input source detection to set the input current limit automatically. The D+/D- detection includes standard USB BC1.2, non-standard adapter, and adjustable high voltage adapter detections. When input source is plugged-in, the device starts standard USB BC1.2 detections. The USB BC1.2 is capable to identify Standard Downstream Port (SDP), Charging Downstream Port (CDP), and Dedicated Charging Port (DCP). When the Data Contact Detection (DCD) timer of 500ms is expired, the non-standard adapter detection is applied to set the input current limit.

When DCP is detected, the device initates adjustable high voltage adapter handshake including MaxCharge™, etc. The handshake connects combinations of voltage source(s) and/or current sink on D+/D- to signal input source to raise output voltage from 5 V to 9 V / 12 V. The adjustable high voltage adapter handshake can be disabled by clearing MAXC_EN and/or HVDCP_EN bits .

Figure 11. USB D+/D- Detection

Table 1. Non-Standard Adapter Detection

NON-STANDARD ADAPTER	D+ THRESHOLD	D- THRESHOLD	INPUT CURRENT LIMIT
Divider 1	VD+ within V2P7_VTH	VD- within V2P0_VTH	2.1A
Divider 2	VD+ within V1P2_VTH	VD- within V1P2_VTH	2A
Divider 3	VD+ within V2P0_VTH	VD- within V2P7_VTH	1A
Divider 4	VD+ within V2P7_VTH	VD- within V2P7_VTH	2.4A

Table 2. Adjustable High Voltage Adapter D+/D- Output Configurations

ADJUSTABLE HIGH VOLTAGE HANDSHAKE	D+	D-	OUTPUT
MaxCharge (12V)	I1P6MA_ISINK	V3p45_VSRC	12 V
MaxCharge (9V)	V3p45_VSRC	I1P6MA_ISINK	9 V

After the Input Source Type Detection is done, an INT pulse is asserted to the host. In addition, the following registers including Input Current Limit register (IINLIM), VBUS_STAT, and SDP_STAT are updated as below:

Table 3. bq25898D Result

D+/D- DETECTION	INPUT CURRENT LIMIT (IINLIM)	SDP_STAT	VBUS_STAT
USB SDP (USB500)	500 mA	1	001
USB CDP	1.5 A	1	010
USB DCP	3.25 A	1	011
Divider 3	1 A	1	110
Divider 1	2.1 A	1	110
Divider 4	2.4 A	1	110
Divider 2	2 A	1	110
MaxCharge	1.5 A	1	100
Unknown Adapter	500 mA	1	101

9.2.3.4 Input Voltage Limit Threshold Setting (VINDPM Threshold)

The device supports wide range of input voltage limit (3.9 V – 14 V) for high voltage charging and provides two methods to set Input Voltage Limit (VINDPM) threshold to facilitate autonomous detection.

1. Absolute VINDPM (FORCE_VINDPM=1)

By setting FORCE_VINDPM bit to 1, the VINDPM threshold setting algorithm is disabled. Register VINDPM is writable and allows host to set the absolute threshold of VINDPM function.

2. Relative VINDPM based on VINDPM_OS registers (FORCE_VINDPM=0) (Default)

When FORCE_VINDPM bit is 0 (default), the VINDPM threshold setting algorithm is enabled. The VINDPM register is read only and the charger controls the register by using VINDPM Threshold setting algorithm. The algorithm allows a wide range of adapter (V_{VBUS_OP}) to be used with flexible VINDPM threshold.

After Input Voltage Limit Threshold is set, an INT pulse is generated to signal to the host.

9.2.3.5 Converter Power-Up

After the input current limit is set, the converter is enabled and the HSFET and LSFET start switching. If battery charging is disabled, BATFET turns off. Otherwise, BATFET stays on to charge the battery.

The device provides soft-start when system rail is ramped up. When the system rail is below 2.2 V, the input current limit is forced to the lower of 200 mA or IINLIM register setting. After the system rises above 2.2 V, the device limits input current to the lower value of ILIM pin and IILIM register (ICO_EN = 0) or IDPM_LIM register (ICO_EN = 1).

As a battery charger, the device deploys a highly efficient 1.5 MHz step-down switching regulator. The fixed frequency oscillator keeps tight control of the switching frequency under all conditions of input voltage, battery voltage, charge current and temperature, simplifying output filter design.

A type III compensation network allows using ceramic capacitors at the output of the converter. An internal saw-tooth ramp is compared to the internal error control signal to vary the duty cycle of the converter. The ramp height is proportional to the PMID voltage to cancel out any loop gain variation due to a change in input voltage.

In order to improve light-load efficiency, the device switches to PFM control at light load when battery is below minimum system voltage setting or charging is disabled. During the PFM operation, the switching duty cycle is set by the ratio of SYS and VBUS.

9.2.6.1 Narrow VDC Architecture

The device deploys Narrow VDC architecture (NVDC) with BATFET separating system from battery. The minimum system voltage is set by SYS_MIN bits. Even with a fully depleted battery, the system is regulated above the minimum system voltage (default 3.5 V).

When the battery is below minimum system voltage setting, the BATFET operates in linear mode (LDO mode), and the system is regulated above the minimum system voltage setting. As the battery voltage rises above the minimum system voltage, BATFET is fully on and the voltage difference between the system and battery is the V_DS of BATFET. The status register VSYS_STAT bit goes high when the system is in minimum system voltage regulation.

Figure 12. V(SYS) vs V(BAT)

9.2.6.2 Dynamic Power Management

To meet maximum current limit in USB spec and avoid over loading the adapter, the device features Dynamic Power Management (DPM), which continuously monitors the input current and input voltage. When input source is over-loaded, either the current exceeds the input current limit (IINLIM or IDPM_LIM) or the voltage falls below the input voltage limit (VINDPM). The device then reduces the charge current until the input current falls below the input current limit and the input voltage rises above the input voltage limit.

When the charge current is reduced to zero, but the input source is still overloaded, the system voltage starts to drop. Once the system voltage falls below the battery voltage, the device automatically enters the Supplement Mode where the BATFET turns on and battery starts discharging so that the system is supported from both the input source and battery.

During DPM mode, the status register bits VDPM_STAT (VINDPM) and/or IDPM_STAT (IINDPM) is/are set high. Figure 13 shows the DPM response with 9V/1.2A adapter, 3.2-V battery, 2.8-A charge current and 3.4-V minimum system voltage setting.

Figure 13. DPM Response

9.2.6.3 Supplement Mode

When the system voltage falls below the battery voltage, the BATFET turns on and the BATFET gate is regulated the gate drive of BATFET so that the minimum BATFET VDS stays at 30 mV when the current is low. This prevents oscillation from entering and exiting the Supplement Mode. As the discharge current increases, the BATFET gate is regulated with a higher voltage to reduce R_DS(ON) until the BATFET is in full conduction. At this point onwards, the BATFET VDS linearly increases with discharge current. Figure 14 shows the V-I curve of the BATFET gate regulation operation. BATFET turns off to exit Supplement Mode when the battery is below battery depletion threshold.

Figure 14. BATFET V-I Curve

9.2.7.1 Autonomous Charging Cycle

With battery charging enabled (CHG_CONFIG bit = 1 and CE pin is low), the device autonomously completes a charging cycle without host involvement. The device default charging parameters are listed in Table 5. The host can always control the charging operations and optimize the charging parameters by writing to the corresponding registers through I²C.

A new charge cycle starts when the following conditions are valid:

• Converter starts
• Battery charging is enabled by setting CHG_CONFIG bit, /CE pin is low and ICHG register is not 0 mA
• No thermistor fault on TS pin
• No safety timer fault
• BATFET is not forced to turn off (BATFET_DIS bit = 0)

The charger device automatically terminates the charging cycle when the charging current is below termination threshold, charge voltage is above recharge threshold, and device not in DPM mode or thermal regulation. When a full battery voltage is discharged below recharge threshold (threshold selectable via VRECHG bit), the device automatically starts a new charging cycle. After the charge is done, either toggle CE pin or CHG_CONFIG bit can initiate a new charging cycle.

The STAT output indicates the charging status of charging (LOW), charging complete or charge disable (HIGH) or charging fault (Blinking). The STAT output can be disabled by setting STAT_DIS bit. In addition, the status register (CHRG_STAT) indicates the different charging phases: 00-charging disable, 01-precharge, 10-fast charge (constant current) and constant voltage mode, 11-charging done. Once a charging cycle is completed, an INT is asserted to notify the host.

9.2.7.2 Battery Charging Profile

The device charges the battery in three phases: preconditioning, constant current and constant voltage. At the beginning of a charging cycle, the device checks the battery voltage and regulates current / voltage.

If the charger device is in DPM regulation or thermal regulation during charging, the charging current can be less than the programmed value. In this case, termination is temporarily disabled and the charging safety timer is counted at half the clock rate.

Figure 15. Battery Charging Profile

9.2.7.3 Charging Termination

The device terminates a charge cycle when the battery voltage is above recharge threshold, and the current is below termination current. After the charging cycle is completed, the BATFET turns off. The converter keeps running to power the system, and BATFET can turn on again to engage Supplement Mode.

When termination occurs, the status register CHRG_STAT is set to 11, and an INT pulse is asserted to the host. Termination is temporarily disabled when the charger device is in input current, voltage or thermal regulation. Termination can be disabled by writing 0 to EN_TERM bit prior to charge termination.

9.2.7.4 Resistance Compensation (IRCOMP)

For high current charging system, resistance between charger output and battery cell terminal such as board routing, connector, MOSFETs and sense resistor can force the charging process to move from constant current to constant voltage too early and increase charge time. To speed up the charging cycle, the device provides resistance compensation (IRCOMP) feature which can extend the constant current charge time to delivery maximum power to battery.

The device allows the host to compensate for the resistance by increasing the voltage regulation set point based on actual charge current and the resistance as shown below. For safe operation, the host should set the maximum allowed regulation voltage register (V_CLAMP) and the minimum resistance compensation (BATCOMP).

9.2.7.5 Thermistor Qualification

9.2.7.5.1 JEITA Guideline Compliance in Charge Mode

To improve the safety of charging Li-ion batteries, JEITA guideline was released on April 20, 2007. The guideline emphasized the importance of avoiding a high charge current and high charge voltage at certain low and high temperature ranges.

The device continuously monitors battery temperature by measuring the voltage between the TS pins and ground, typically determined by a negative temperature coefficient thermistor (NTC) and an external voltage divider. The device compares this voltage against its internal thresholds to determine if charging is allowed. To initiate a charge cycle, the voltage on TS pin must be within the V_T1 to V_T5 thresholds. If TS voltage exceeds the T1–T5 range, the controller suspends charging and waits until the battery temperature is within the T1 to T5 range. At cool temperature (T1–T2), JEITA recommends the charge current to be reduced to at least half of the charge current or lower. At warm temperature (T3–T5), JEITA recommends charge voltage below nominal charge voltage.

The device provides flexible voltage/current settings beyond the JEITA requirement. The voltage setting at warm temperature (T3–T5) can be 200 mV below charge voltage (JEITA_VSET=0). The current setting at cool temperature (T1–T2) can be further reduced to 20% or 50% of fast charge current (JEITA_ISET bit).

Figure 16. TS Resistor Network

Figure 17. Charging Values

Assuming a 103AT NTC thermistor on the battery pack as shown in Figure 16, the value RT1 and RT2 can be determined by using Equation 2:

Equation 2.

Select 0°C to 60°C range for Li-ion or Li-polymer battery,
RTH_T1 = 27.28 kΩ
RTH_T5 = 3.02 kΩ
RT1 = 5.24 kΩ
RT2 = 30.31 kΩ

During JEITA cool, the bq25898x terminates when the charge current has reached 20% or 50% of termination current setting, depending on the JT_IREDUCE bit. During JEITA warm, the bq25898x terminates when the charge current reaches the termination current setting.

9.2.7.5.2 Cold/Hot Temperature Window in Boost Mode

For battery protection during boost mode, the device monitors the battery temperature to be within the V_BCOLD1 to V_BHOT2 thresholds unless boost mode temperature is disabled by setting BHOT bits to 11. When temperature is outside of the temperature thresholds, the boost mode is suspended. Once temperature is within thresholds, the boost mode is recovered.

Figure 18. TS Pin Thermistor Sense Thresholds in Boost Mode

9.2.7.6 Charging Safety Timer

The device has built-in safety timer to prevent extended charging cycle due to abnormal battery conditions. The safety timer is 4 hours when the battery is below V_BATLOWV threshold. The user can program fast charge safety timer through I²C (CHG_TIMER bits). When safety timer expires, the fault register CHRG_FAULT bits are set to 11 and an INT is asserted to the host. The safety timer feature can be disabled via I2C by setting EN_TIMER bit.

During input voltage, current or thermal regulation, the safety timer counts at half clock rate as the actual charge current is likely to be below the register setting. For example, if the charger is in input current regulation (IDPM_STAT = 1) throughout the whole charging cycle, and the safety time is set to 5 hours, the safety timer will expire in 10 hours. This half clock rate feature can be disabled by writing 0 to TMR2X_EN bit.

Table 7. Battery Monitor Modes of Operation

9.2.9.1 Power Good Indicator (PG)

In bq25898, the PG goes LOW to indicate a good input source when:

1. VBUS above V_{VBUS_UVLO}
2. VBUS above battery (not in sleep)
3. VBUS below V_ACOV threshold
4. VBUS above V_VBUSMIN (typical 3.8 V) when I_BADSRC (typical 30 mA) current is applied (not a poor source)
5. Completed Input Source Type Detection

9.2.9.2 Charging Status Indicator (STAT)

The device indicates charging state on the open drain STAT pin. The STAT pin can drive LED as shown in Figure 49. The STAT pin function can be disable by setting STAT_DIS bit.

9.2.9.3 Interrupt to Host (INT)

In some applications, the host does not always monitor the charger operation. The INT notifies the system on the device operation. The following events will generate 256-µs INT pulse.

• USB/adapter source identified (through PSEL or DPDM detection, with OTG pin)
• Good input source detected
  • VBUS above battery (not in sleep)
  • VBUS below V_ACOV threshold
  • VBUS above V_VBUSMIN (typical 3.8 V) when I_BADSRC (typical 30 mA) current is applied (not a poor source)
• Input removed
• Charge Complete
• Any FAULT event in REG0C

When a fault occurs, the charger device sends out INT and keeps the fault state in REG0C until the host reads the fault register. Before the host reads REG0C and all the faults are cleared, the charger device would not send any INT upon new faults. To read the current fault status, the host has to read REG0C two times consecutively. The 1^st read reports the pre-existing fault register status and the 2^nd read reports the current fault register status.

9.2.10.1 BATFET Disable Mode (Shipping Mode)

To extend battery life and minimize power when system is powered off during system idle, shipping, or storage, the device can turn off BATFET so that the system voltage is zero to minimize the battery leakage current. When the host set BATFET_DIS bit, the charger can turn off BATFET immediately or delay by t_{SM_DLY} as configurated by BATFET_DLY bit.

9.2.10.2 BATFET Enable (Exit Shipping Mode)

When the BATFET is disabled (in shipping mode) and indicated by setting BATFET_DIS, one of the following events can enable BATFET to restore system power:

1. Plug in adapter
2. Clear BATFET_DIS bit
3. Set REG_RST bit to reset all registers including BATFET_DIS bit to default (0)
4. A logic high to low transition on QON pin with t_SHIPMODE deglitch time to enable BATFET to exit shipping mode

9.2.10.3 BATFET Full System Reset

The BATFET functions as a load switch between battery and system when input source is not plugged-in. By changing the state of BATFET from off to on, system connects to SYS can be effectively have a power-on-reset. The QON pin supports push-button interface to reset system power without host by change the state of BATFET.

When the QON pin is driven to logic low for t_{QON_RST} (typical 15 seconds) while input source is not plugged in and BATFET is enabled (BATFET_DIS=0), the BATFET is turned off for t_{BATFET_RST} and then it is re-enabled to reset system power. This function can be disabled by setting BATFET_RST_EN bit to 0.

9.2.13.1 Thermal Protection in Buck Mode

The device monitors the internal junction temperature T_J to avoid overheat the chip and limits the IC surface temperature in buck mode. When the internal junction temperature exceeds the preset thermal regulation limit (TREG bits), the device lowers down the charge current. The wide thermal regulation range from 60ºC to 120ºC allows the user to optimize the system thermal performance.

During thermal regulation, the actual charging current is usually below the programmed battery charging current. Therefore, termination is disabled, the safety timer runs at half the clock rate, and the status register THERM_STAT bit goes high.

Additionally, the device has thermal shutdown to turn off the converter and BATFET when IC surface temperature exceeds T_SHUT. The fault register CHRG_FAULT is set to 10 and an INT is asserted to the host. The BATFET and converter is enabled to recover when IC temperature is below T_{SHUT_HYS}.

9.2.14.1 Voltage and Current Monitoring in Buck Mode

The device closely monitors the input and system voltage, as well as HSFET current for safe buck and boost mode operations.

9.2.14.2 Voltage and Current Monitoring in Boost Mode

The device closely monitors the VBUS voltage, as well as RBFET and LSFET current to ensure safe boost mode operation.

9.2.15.1 Battery Overvoltage Protection (BATOVP)

The battery overvoltage limit is clamped at 4% above the battery regulation voltage. When battery over voltage occurs, the charger device immediately disables charge. The fault register BAT_FAULT bit goes high and an INT is asserted to the host.

9.2.15.2 Battery Over-Discharge Protection

When battery is discharged below V_{BAT_DPL}, the BATFET is turned off to protect battery from over discharge. To recover from over-discharge, an input source is required at VBUS. When an input source is plugged in, the BATFET turns on. Thy is charged with I_BATSHORT (typically 100 mA) current when the VBAT < V_SHORT, or precharge current as set in IPRECHG register when the battery voltage is between V_SHORT and V_BATLOWV.

9.2.15.3 System Overcurrent Protection

When the system is shorted or significantly overloaded (I_BAT > I_BATOP) so that its current exceeds the overcurrent limit, the device latches off BATFET. Section BATFET Enable (Exit Shipping Mode) can reset the latch-off condition and turn on BATFET.

9.2.16.1 Data Validity

The data on the SDA line must be stable during the HIGH period of the clock. The HIGH or LOW state of the data line can only change when the clock signal on the SCL line is LOW. One clock pulse is generated for each data bit transferred.

Figure 19. Bit Transfer on the I²C Bus

9.2.16.2 START and STOP Conditions

All transactions begin with a START (S) and can be terminated by a STOP (P). A HIGH to LOW transition on the SDA line while SCl is HIGH defines a START condition. A LOW to HIGH transition on the SDA line when the SCL is HIGH defines a STOP condition.

START and STOP conditions are always generated by the master. The bus is considered busy after the START condition, and free after the STOP condition.

Figure 20. START and STOP conditions

9.2.16.3 Byte Format

Every byte on the SDA line must be 8 bits long. The number of bytes to be transmitted per transfer is unrestricted. Each byte has to be followed by an Acknowledge bit. Data is transferred with the Most Significant Bit (MSB) first. If a slave cannot receive or transmit another complete byte of data until it has performed some other function, it can hold the clock line SCL low to force the master into a wait state (clock stretching). Data transfer then continues when the slave is ready for another byte of data and release the clock line SCL.

Figure 21. Data Transfer on the I²C Bus

9.2.16.4 Acknowledge (ACK) and Not Acknowledge (NACK)

The acknowledge takes place after every byte. The acknowledge bit allows the receiver to signal the transmitter that the byte was successfully received and another byte may be sent. All clock pulses, including the acknowledge 9^th clock pulse, are generated by the master.

The transmitter releases the SDA line during the acknowledge clock pulse so the receiver can pull the SDA line LOW and it remains stable LOW during the HIGH period of this clock pulse.

When SDA remains HIGH during the 9^th clock pulse, this is the Not Acknowledge signal. The master can then generate either a STOP to abort the transfer or a repeated START to start a new transfer.

9.2.16.5 Slave Address and Data Direction Bit

After the START, a slave address is sent. This address is 7 bits long followed by the eighth bit as a data direction bit (bit R/W). A zero indicates a transmission (WRITE) and a one indicates a request for data (READ).

Figure 22. Complete Data Transfer

9.2.16.6 Single Read and Write

Figure 23. Single Write

Figure 24. Single Read

If the register address is not defined, the charger IC send back NACK and go back to the idle state.

9.2.16.7 Multi-Read and Multi-Write

The charger device supports multi-read and multi-write on REG00 through REG14 except REG0C.

Figure 25. Multi-Write

Figure 26. Multi-Read

REG0C is a fault register. It keeps all the fault information from last read until the host issues a new read. For example, if Charge Safety Timer Expiration fault occurs but recovers later, the fault register REG0C reports the fault when it is read the first time, but returns to normal when it is read the second time. In order to get the fault information at present, the host has to read REG0C for the second time. The only exception is NTC_FAULT which always reports the actual condition on the TS pin. In addition, REG0C does not support multi-read and multi-write.

Table 9. REG00

Table 10. REG01

Table 11. REG02

Table 12. REG03

Table 13. REG04

Table 14. REG05

Table 15. REG06

Table 16. REG07

Table 17. REG08

Table 18. REG09

Table 19. REG0A

Table 20. REG0B

Table 21. REG0C

Table 22. REG0D

Table 23. REG0E

Table 24. REG0F

Table 25. REG10

Table 26. REG11

Table 27. REG12

Table 28. REG13

Table 29. REG14