ZHCSCR2 July   2014

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 簡(jiǎn)化電路原理圖
5. 5 修訂歷史記錄
6. 6 說(shuō)明（續(xù)）
7. 7 Pin Configuration and Functions
8. 8 Specifications
   1. 8.1  Absolute Maximum Ratings
   2. 8.2  Handling Ratings
   3. 8.3  Recommended Operating Conditions
   4. 8.4  Thermal Information
   5. 8.5  Electrical Characteristics: Supply Current
   6. 8.6  Electrical Characteristics: I/O
   7. 8.7  Electrical Characteristics: ADC
   8. 8.8  Electrical Characteristics: Power-On Reset
   9. 8.9  Electrical Characteristics: Oscillator
   10. 8.10 Electrical Characteristics: Data Flash Memory
   11. 8.11 Electrical Characteristics: Register Backup
   12. 8.12 SMBus Timing Specifications
   13. 8.13 Typical Characteristics
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Primary (1st Level) Safety Features
      2. 9.3.2 Secondary (2nd Level) Safety Features
      3. 9.3.3 Charge Control Features
      4. 9.3.4 Fuel Gauging
      5. 9.3.5 Lifetime Data Logging
      6. 9.3.6 Authentication
      7. 9.3.7 Battery Parameter Measurements
         1. 9.3.7.1 Current and Coulomb Counting
         2. 9.3.7.2 Voltage
         3. 9.3.7.3 Temperature
   4. 9.4 Device Functional Modes
   5. 9.5 Programming
      1. 9.5.1 Physical Interface
      2. 9.5.2 SMBus Address
      3. 9.5.3 SMBus On and Off State
10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
       1. 10.2.1 Schematic
       2. 10.2.2 Design Requirements
       3. 10.2.3 Detailed Design Procedure
          1. 10.2.3.1 Measurement System
             1. 10.2.3.1.1 Cell Voltages
             2. 10.2.3.1.2 External Average Cell Voltage
             3. 10.2.3.1.3 Current
             4. 10.2.3.1.4 Temperature
          2. 10.2.3.2 Gas Gauging
          3. 10.2.3.3 Charging
             1. 10.2.3.3.1 Fast Charging Voltage
             2. 10.2.3.3.2 Fast Charging Current
             3. 10.2.3.3.3 Other Charging Modes
          4. 10.2.3.4 Protection
          5. 10.2.3.5 Peripheral Features
             1. 10.2.3.5.1 LED Display
             2. 10.2.3.5.2 SMBus Address
       4. 10.2.4 Application Performance Plots
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
       1. 12.1.1 Power Supply Decoupling Capacitor
       2. 12.1.2 MRST Connection
       3. 12.1.3 Communication Line Protection Components
       4. 12.1.4 ESD Spark Gap
    2. 12.2 Layout Example
13. 13器件和文檔支持
    1. 13.1 相關(guān)文檔　
    2. 13.2 商標(biāo)
    3. 13.3 靜電放電警告
    4. 13.4 術(shù)語(yǔ)表
14. 14機(jī)械封裝和可訂購(gòu)信息