ZHCSKE9C December   2015  – October 2019 DS250DF810

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
   1.     Device Images
      1.      簡(jiǎn)化原理圖
4. 4 修訂歷史記錄
5. 5 說(shuō)明 （續(xù)）
6. 6 Pin Configuration and Functions
   1.     Pin Functions
7. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Electrical Characteristics
   6. 7.6  Timing Requirements, Retimer Jitter Specifications
   7. 7.7  Timing Requirements, Retimer Specifications
   8. 7.8  Timing Requirements, Recommended Calibration Clock Specifications
   9. 7.9  Recommended SMBus Switching Characteristics (Slave Mode)
   10. 7.10 Recommended SMBus Switching Characteristics (Master Mode)
   11. 7.11 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1  Device Data Path Operation
      2. 8.3.2  AC-Coupled Receiver and Transmitter
      3. 8.3.3  Signal Detect
      4. 8.3.4  Continuous Time Linear Equalizer (CTLE)
      5. 8.3.5  Variable Gain Amplifier (VGA)
      6. 8.3.6  Cross-Point Switch
      7. 8.3.7  Decision Feedback Equalizer (DFE)
      8. 8.3.8  Clock and Data Recovery (CDR)
      9. 8.3.9  Calibration Clock
      10. 8.3.10 Differential Driver with FIR Filter
      11. 8.3.11 Setting the Output VOD
      12. 8.3.12 Output Driver Polarity Inversion
      13. 8.3.13 Debug Features
          1. 8.3.13.1 Pattern Generator
          2. 8.3.13.2 Pattern Checker
          3. 8.3.13.3 Eye Opening Monitor
      14. 8.3.14 Interrupt Signals
   4. 8.4 Device Functional Modes
      1. 8.4.1 Supported Data Rates
      2. 8.4.2 SMBus Master Mode
      3. 8.4.3 Device SMBus Address
   5. 8.5 Programming
      1. 8.5.1 Bit Fields in the Register Set
      2. 8.5.2 Writing to and Reading from the Global/Shared/Channel Registers
   6. 8.6 Register Maps
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Backplane and Mid-Plane Applications
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
12. 12器件和文檔支持
    1. 12.1 器件支持
       1. 12.1.1 開(kāi)發(fā)支持
    2. 12.2 文檔支持
       1. 12.2.1 相關(guān)文檔
    3. 12.3 接收文檔更新通知
    4. 12.4 支持資源
    5. 12.5 商標(biāo)
    6. 12.6 靜電放電警告
    7. 12.7 Glossary
13. 13機(jī)械、封裝和可訂購(gòu)信息