ZHCSGT5A June   2017  – June 2021 LP873222-Q1

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說明
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 I2C Serial Bus Timing Parameters
   7. 6.7 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1  DC/DC Converters
         1. 7.3.1.1 Overview
         2. 7.3.1.2 Transition Between PWM and PFM Modes
         3. 7.3.1.3 Buck Converter Load Current Measurement
         4. 7.3.1.4 Spread-Spectrum Mode
      2. 7.3.2  Sync Clock Functionality
      3. 7.3.3  Low-Dropout Linear Regulators (LDOs)
      4. 7.3.4  Power-Up
      5. 7.3.5  Regulator Control
         1. 7.3.5.1 Enabling and Disabling Regulators
         2. 7.3.5.2 Changing Output Voltage
      6. 7.3.6  Enable and Disable Sequences
      7. 7.3.7  Device Reset Scenarios
      8. 7.3.8  Diagnosis and Protection Features
         1. 7.3.8.1 Power-Good Information (PGOOD pin)
            1. 7.3.8.1.1 PGOOD Pin Gated Mode
            2. 7.3.8.1.2 PGOOD Pin Continuous Mode
            3. 7.3.8.1.3 PGOOD Pin Inactive Mode
         2. 7.3.8.2 Warnings for Diagnosis (Interrupt)
            1. 7.3.8.2.1 Output Power Limit
            2. 7.3.8.2.2 Thermal Warning
         3. 7.3.8.3 Protection (Regulator Disable)
            1. 7.3.8.3.1 Short-Circuit and Overload Protection
            2. 7.3.8.3.2 Overvoltage Protection
            3. 7.3.8.3.3 Thermal Shutdown
         4. 7.3.8.4 Fault (Power Down)
            1. 7.3.8.4.1 Undervoltage Lockout
      9. 7.3.9  Operation of the GPO Signals
      10. 7.3.10 Digital Signal Filtering
   4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
   5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
         1. 7.5.1.1 Data Validity
         2. 7.5.1.2 Start and Stop Conditions
         3. 7.5.1.3 Transferring Data
         4. 7.5.1.4 I2C-Compatible Chip Address
         5. 7.5.1.5 Auto-Increment Feature
   6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
         1. 7.6.1.1  DEV_REV
         2. 7.6.1.2  OTP_REV
         3. 7.6.1.3  BUCK0_CTRL_1
         4. 7.6.1.4  BUCK0_CTRL_2
         5. 7.6.1.5  BUCK1_CTRL_1
         6. 7.6.1.6  BUCK1_CTRL_2
         7. 7.6.1.7  BUCK0_VOUT
         8. 7.6.1.8  BUCK1_VOUT
         9. 7.6.1.9  LDO0_CTRL
         10. 7.6.1.10 LDO1_CTRL
         11. 7.6.1.11 LDO0_VOUT
         12. 7.6.1.12 LDO1_VOUT
         13. 7.6.1.13 BUCK0_DELAY
         14. 7.6.1.14 BUCK1_DELAY
         15. 7.6.1.15 LDO0_DELAY
         16. 7.6.1.16 LDO1_DELAY
         17. 7.6.1.17 GPO_DELAY
         18. 7.6.1.18 GPO2_DELAY
         19. 7.6.1.19 GPO_CTRL
         20. 7.6.1.20 CONFIG
         21. 7.6.1.21 PLL_CTRL
         22. 7.6.1.22 PGOOD_CTRL_1
         23. 7.6.1.23 PGOOD_CTRL_2
         24. 7.6.1.24 PG_FAULT
         25. 7.6.1.25 RESET
         26. 7.6.1.26 INT_TOP_1
         27. 7.6.1.27 INT_TOP_2
         28. 7.6.1.28 INT_BUCK
         29. 7.6.1.29 INT_LDO
         30. 7.6.1.30 TOP_STAT
         31. 7.6.1.31 BUCK_STAT
         32. 7.6.1.32 LDO_STAT
         33. 7.6.1.33 TOP_MASK_1
         34. 7.6.1.34 TOP_MASK_2
         35. 7.6.1.35 BUCK_MASK
         36. 7.6.1.36 LDO_MASK
         37. 7.6.1.37 SEL_I_LOAD
         38. 7.6.1.38 I_LOAD_2
         39. 7.6.1.39 I_LOAD_1
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
         1. 8.2.1.1 Inductor Selection
         2. 8.2.1.2 Buck Input Capacitor Selection
         3. 8.2.1.3 Buck Output Capacitor Selection
         4. 8.2.1.4 LDO Input Capacitor Selection
         5. 8.2.1.5 LDO Output Capacitor Selection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
11. 11Device and Documentation Support
    1. 11.1 Device Support
       1. 11.1.1 第三方產(chǎn)品免責聲明
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持資源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
12. 12Mechanical, Packaging, and Orderable Information