ZHCSR22A June 2021 – September 2022 LP876242-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LP876x-Q1 | UNIT | |
|---|---|---|---|
| RQK (VQFN-HR) | |||
| 32 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 30.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 9.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 6.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 5.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 7.5 | °C/W |