4 Revision History
Changes from Revision A (January 2017) to Revision B (March 2022)
- 更新了整個文檔中的表格、圖和交叉參考的編號格式Go
- Added the Thermal Package information to the Pin Functions
tableGo
- Added TFP401A-Q1 to the Imax vs Input Frequency
figureGo
- Added sentence to end of first
paragraph that recommends soldering package
thermal pad to PCB in order to minimize stress on
peripheral pinsGo
Changes from Revision * (November 2012) to Revision A (January 2017)
- 添加了器件信息 表、引腳配置和功能 部分、ESD 等級 表、應用和實施 部分、電源相關建議 部分、布局 部分、器件和文檔支持 部分以及機械、封裝和可訂購信息 部分Go
- 將特性 部分中的“器件 HBM ESD 分類等級 C3B”更改為“器件 CDM ESD 分類等級 C3”Go
- Changed the Operating free-air temperature MIN value From: 0°C To: –40°C and the MAX value From: 70°C To: 85°C in the Recommended Operating Conditions
Go
- Changed the Thermal Information table valuesGo