9 Revision History
Changes from Revision P (February 2017) to Revision Q (August 2024)
- 更新了整個(gè)文檔中的表格、圖和交叉參考的編號(hào)格式Go
- 將器件信息 表更改為封裝信息
Go
- Changed thermal metric values in the Thermal Information
sectionGo
- Removed CFP package footnote about thermal land pad requirements in
Thermal Information sectionGo
Changes from Revision O (March 2016) to Revision P (February 2017)
- Changed column header of Table 6-4 indicating correct order of receive data bus bitsGo
Changes from Revision N (December 2015) to Revision O (March 2016)
- Changed reference to table note (2) Internal 10-kΩ pulldown for
TKLSB and TKMSBGo
Changes from Revision M (October 2014) to Revision N (December 2015)
- Updated the frequency range of TXCLK Go
- Updated Handling Ratings table to an ESD Ratings table and moved Tstg to the Absolute Maximum Ratings tableGo
Changes from Revision K (July 2014) to Revision L (August 2014)
- Updated Power-On/Reset Timing Diagram optionsGo
Changes from Revision J (May 2014) to Revision K (July 2014)
- Updated pin description for ENABLEGo
- Updated pin voltages in Absolute Maximum Ratings
Go
- Added more information to
Power-On Reset
detailing two power-on/reset timing options Go
Changes from Revision I (January 2014) to Revision J (April 2014)
- 更改了格式，以符合最新的數(shù)據(jù)表標(biāo)準(zhǔn)；添加了新的部分，并移動(dòng)了現(xiàn)有部分Go
- 更改了說(shuō)明
Go
- 更改了說(shuō)明 中有關(guān) LCKREFN 的段落Go
- Changed Description of LCKREFN in
Pin Configuration and
Functions
Go
- Changed
Power-On Reset
section Go
Changes from Revision H (December 2013) to Revision I (January 2014)