ZHCSE08D May   2015  – January 2020 TMP107

PRODUCTION DATA.  

1. 1 特性
2. 2 應用范圍
3. 3 說明
   1.     Device Images
      1.      典型應用
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
   1.     Pin Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 Timing Requirements
   7. 6.7 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Temperature Limits and Alert
         1. 7.3.2.1 ALERT1, ALERT2, R1, and R2 Pins
      3. 7.3.3 SMAART Wire™ Communication Interface
         1. 7.3.3.1 Communication Protocol
            1. 7.3.3.1.1 Calibration Phase
            2. 7.3.3.1.2 Command and Address Phase
               1. 7.3.3.1.2.1 Global or Individual (G/nI) Bit
               2. 7.3.3.1.2.2 Read/Write (R/nW) Bit
               3. 7.3.3.1.2.3 Command or Address (C/nA) Bit:
            3. 7.3.3.1.3 Register Pointer Phase
            4. 7.3.3.1.4 Data Phase
         2. 7.3.3.2 SMAART Wire™ Operations
            1. 7.3.3.2.1 Command Operations
               1. 7.3.3.2.1.1 Address Initialize
               2. 7.3.3.2.1.2 Last Device Poll
               3. 7.3.3.2.1.3 Global Software Reset
            2. 7.3.3.2.2 Address Operations
               1. 7.3.3.2.2.1 Individual Write
               2. 7.3.3.2.2.2 Individual Read
               3. 7.3.3.2.2.3 Global Write
               4. 7.3.3.2.2.4 Global Read
   4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 One-Shot Mode
   5. 7.5 Programming
      1. 7.5.1 EEPROM
      2. 7.5.2 EEPROM Operations
         1. 7.5.2.1 EEPROM Unlock
         2. 7.5.2.2 EEPROM Lock
         3. 7.5.2.3 EEPROM Programming
         4. 7.5.2.4 EEPROM Acquire or Read
   6. 7.6 Register Map
      1. 7.6.1 Temperature Register (address = 0h) [reset = 0h]
         1. Table 4. Temperature Register Field Descriptions
      2. 7.6.2 Configuration Register (address = 1h) [reset = A000h]
         1. Table 5. Configuration Register Field Descriptions
      3. 7.6.3 High Limit 1 Register (address = 2h) [reset = 7FFCh]
         1. Table 7. High Limit 1 Register Field Descriptions
      4. 7.6.4 Low Limit 1 Register (address = 3h) [reset = 8000h]
         1. Table 8. Low Limit 1 Register Field Descriptions
      5. 7.6.5 High Limit 2 Register (address = 4h) [reset = 7FFCh]
         1. Table 9. High Limit 2 Register Field Descriptions
      6. 7.6.6 Low Limit 2 Register (address = 5h) [reset = 8000h]
         1. Table 10. Low Limit 2 Register Field Descriptions
      7. 7.6.7 EEPROM n Register (where n = 1 to 8) (addresses = 6h to Dh) [reset = 0h]
         1. Table 11. EEPROM Register bits
      8. 7.6.8 Die ID Register (address = Fh) [reset = 1107h]
         1. Table 12. Die ID Register Field Descriptions
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Applications
      1. 8.2.1 Connecting Multiple Devices
         1. 8.2.1.1 Design Requirements
         2. 8.2.1.2 Detailed Design Procedure
            1. 8.2.1.2.1 Voltage Drop Effect
            2. 8.2.1.2.2 EEPROM Programming Current
            3. 8.2.1.2.3 Power Savings
            4. 8.2.1.2.4 Accuracy
            5. 8.2.1.2.5 Electromagnetic Interference (EMI)
         3. 8.2.1.3 Application Curves
      2. 8.2.2 Connecting ALERT1 and ALERT2 Pins
      3. 8.2.3 ALERT1 and ALERT2 Pins Used as General-Purpose Output (GPO)
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
11. 11器件和文檔支持
    1. 11.1 文檔支持
       1. 11.1.1 相關文檔
    2. 11.2 接收文檔更新通知
    3. 11.3 社區(qū)資源
    4. 11.4 商標
    5. 11.5 靜電放電警告
    6. 11.6 Glossary
12. 12機械、封裝和可訂購信息