ZHCSF30F May 2016 – January 2020 TPA3136AD2 , TPA3136D2
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Parameter Measurement Information
- 9 Detailed Description
-
10Application and Implementation
- 10.1 Application Information
- 10.2
Typical Applications
- 10.2.1 Design Requirements
- 10.2.2
Detailed Design Procedure
- 10.2.2.1 Ferrite Bead Filter Considerations
- 10.2.2.2 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
- 10.2.2.3 When to Use an Output Filter for EMI Suppression
- 10.2.2.4 Input Resistance
- 10.2.2.5 Input Capacitor, Ci
- 10.2.2.6 BSN and BSP Capacitors
- 10.2.2.7 Differential Inputs
- 10.2.2.8 Using Low-ESR Capacitors
- 10.2.3 Application Performance Curves
- 11Power Supply Recommendations
- 12Layout
- 13器件和文檔支持
- 14機械、封裝和可訂購信息
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- PWP|28
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- PWP|28
訂購信息
13.7 靜電放電警告
這些裝置包含有限的內置 ESD 保護。 存儲或裝卸時，應將導線一起截短或將裝置放置于導電泡棉中，以防止 MOS 門極遭受靜電損傷。