4 修訂歷史記錄
Changes from B Revision (September 2015) to C Revision
- Changed pinout diagram for compatibility with HTML versioin of the data sheetGo
- Added REFOUT specification for –1 mA ≤ IREFOUT ≤ 1 mA, condition Go
- Corrected Typical Characteristics condition statementGo
- Added Figure 4Go
- Added Figure 9Go
- 添加接收文檔更新通知部分Go
Changes from A Revision (April 2012) to B Revision
- Added 將 AEC-Q100 有關溫度等級以及 HBM 和 CDM 分類的測試指導結果添加至特性列表Go
- Added 引腳配置和功能 部分、ESD 額定值 表、特性 說明 部分、器件功能模式、應用和實施 部分、電源建議 部分、布局 部分、器件和文檔支持 部分以及機械、封裝和可訂購信息 部分Go
- 將 PowerPAD 的引用內(nèi)容替換為散熱焊盤Go
- Deleted ORDERING INFORMATION tableGo
- Deleted DISSIPATION RATINGS TABLEGo
- Changed the thermal metric parameters in the Thermal Information table Go
- Changed the test conditions for REFOUT source and sink current limits in the Electrical Characteristics table Go
- Added -Q1 to device name throughout text of documentGo
Changes from * Revision (November 2009) to A Revision
- Added thermal table information for DRC package.Go