4 修訂歷史記錄
Changes from D Revision (October 2017) to E Revision
- 從特性、說(shuō)明 和器件信息 中刪除了 TUSB1002I 工業(yè)Go
- Deleted TUSB1002I Operating free-air temperature from the Recommended Operating ConditionsGo
- Deleted TUSB1002I from the Thermal Information tableGo
Changes from C Revision (August 2017) to D Revision
- Changed pin 8 From: RXIN To: RX1N in the RGE pin imageGo
Changes from B Revision (August 2017) to C Revision
- 在特性中將“14 種線性均衡設(shè)置，在速率為 10Gbps 時(shí)最高為 15dB”更改成了“16 種線性均衡設(shè)置，在速率為 10Gbps 時(shí)最高為 16 dB”Go
- Deleted the RMQ package option from the Pin Configuration and Functions section Go
- Deleted the RMQ package from the Pin Functions table Go
- Changed the description of pin 7 From: R = Test Mode To: R = PCIe / Test Mode. in the Pin Functions table Go
- Deleted the RMQ column from Thermal Information table Go
- Added Differential crosstalk between TX and RX signal pairs. Go
- From: EQ(GAIN-10Gbps) 15dB To: EQ(GAIN-10Gbps) 16dBGo
- EQ setting 15 changed from Reserved to 10.4 / 16.0 Go
- EQ setting 16 changed from Reserved to 10.6 / 16.3 Go
- Added the PCIe/SATA/SATA Express Redriver Operation section. Go
- Added the Typical SATA, PCIe, and SATA Expess Application section Go
Changes from A Revision (May 2016) to B Revision
- 向簡(jiǎn)化原理圖的 RXP2 和 RXN2 引腳添加了一個(gè)電容器Go
- Added a capacitor to the RXP2 and RXN2 pins of Figure 17Go
- Updated the A/C coupling Capacitor section of Table 4Go
- Changed text in the Detailed Design Procedure From: No A/C coupling capacitors are placed on the RX2P/N. To: 330nF A/C coupling capacitors along with 220k resistors are placed on the RX2P and RX2N. Inclusion of these 330nF capacitors and 220k resistors is optional but highly recommended. If not implemented, then RX2P/N should be DC-coupled to the USB receptacle.Go
- Added 330nF AC capacitors (C12 and C13) on RX2P and RX2N in Figure 18Go
Changes from * Revision (May 2016) to A Revision
- 已將器件狀態(tài)由“產(chǎn)品預(yù)覽”改為“量產(chǎn)數(shù)據(jù)”Go