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DS90CR285

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+3.3V 上升沿數(shù)據(jù)選通 LVDS 28 位通道鏈路發(fā)射器 — 66MHz

產(chǎn)品詳情

Protocols Catalog Device type Transmitter Rating Catalog Operating temperature range (°C) -40 to 85
Protocols Catalog Device type Transmitter Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (DGG) 56 113.4 mm2 14 x 8.1
  • Single +3.3V Supply
  • Chipset (Tx + Rx) Power Consumption <250 mW (typ)
  • Power-Down Mode (<0.5 mW total)
  • Up to 231 Megabytes/sec Bandwidth
  • Up to 1.848 Gbps Data Throughput
  • Narrow Bus Reduces Cable Size
  • 290 mV Swing LVDS Devices for Low EMI
  • +1V Common Mode Range (Around +1.2V)
  • PLL Requires no External Components
  • Both Devices are Offered in a Low Profile 56-Lead TSSOP Package
  • Rising Edge Data Strobe
  • Compatible with TIA/EIA-644 LVDS Standard
  • ESD Rating > 7 kV
  • Operating Temperature: ?40°C to +85°C

All trademarks are the property of their respective owners.

  • Single +3.3V Supply
  • Chipset (Tx + Rx) Power Consumption <250 mW (typ)
  • Power-Down Mode (<0.5 mW total)
  • Up to 231 Megabytes/sec Bandwidth
  • Up to 1.848 Gbps Data Throughput
  • Narrow Bus Reduces Cable Size
  • 290 mV Swing LVDS Devices for Low EMI
  • +1V Common Mode Range (Around +1.2V)
  • PLL Requires no External Components
  • Both Devices are Offered in a Low Profile 56-Lead TSSOP Package
  • Rising Edge Data Strobe
  • Compatible with TIA/EIA-644 LVDS Standard
  • ESD Rating > 7 kV
  • Operating Temperature: ?40°C to +85°C

All trademarks are the property of their respective owners.

The DS90CR285 transmitter converts 28 bits of LVCMOS/LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CR286 receiver converts the LVDS data streams back into 28 bits of LVCMOS/LVTTL data. At a transmit clock frequency of 66 MHz, 28 bits of TTL data are transmitted at a rate of 462 Mbps per LVDS data channel. Using a 66 MHz clock, the data throughput is 1.848 Gbit/s (231 Mbytes/s).

The multiplexing of the data lines provides a substantial cable reduction. Long distance parallel single-ended buses typically require a ground wire per active signal (and have very limited noise rejection capability). Thus, for a 28-bit wide data and one clock, up to 58 conductors are required. With the Channel Link chipset as few as 11 conductors (4 data pairs, 1 clock pair and a minimum of one ground) are needed. This provides a 80% reduction in required cable width, which provides a system cost savings, reduces connector physical size and cost, and reduces shielding requirements due to the cables' smaller form factor.

The 28 LVCMOS/LVTTL inputs can support a variety of signal combinations. For example, seven 4-bit nibbles or three 9-bit (byte + parity) and 1 control.

The DS90CR285 transmitter converts 28 bits of LVCMOS/LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CR286 receiver converts the LVDS data streams back into 28 bits of LVCMOS/LVTTL data. At a transmit clock frequency of 66 MHz, 28 bits of TTL data are transmitted at a rate of 462 Mbps per LVDS data channel. Using a 66 MHz clock, the data throughput is 1.848 Gbit/s (231 Mbytes/s).

The multiplexing of the data lines provides a substantial cable reduction. Long distance parallel single-ended buses typically require a ground wire per active signal (and have very limited noise rejection capability). Thus, for a 28-bit wide data and one clock, up to 58 conductors are required. With the Channel Link chipset as few as 11 conductors (4 data pairs, 1 clock pair and a minimum of one ground) are needed. This provides a 80% reduction in required cable width, which provides a system cost savings, reduces connector physical size and cost, and reduces shielding requirements due to the cables' smaller form factor.

The 28 LVCMOS/LVTTL inputs can support a variety of signal combinations. For example, seven 4-bit nibbles or three 9-bit (byte + parity) and 1 control.

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頂層文檔 類型 標題 格式選項 下載最新的英語版本 日期
* 數(shù)據(jù)表 DS90CR285/DS90CR286 3.3V Rising Edge Data Strobe LVDS 28Bit Channel Link- 66MHz 數(shù)據(jù)表 (Rev. C) 2013年 3月 5日
應用手冊 High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs 2018年 11月 9日
應用手冊 AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines (Rev. A) 2018年 8月 3日
應用手冊 Receiver Skew Margin for Channel Link I and FPD Link I Devices 2016年 1月 13日
應用手冊 Improving the Robustness of Channel Link Designs with Channel Link II Ser/Des (Rev. A) 2013年 4月 26日
設計指南 Channel Link I Design Guide 2007年 3月 29日
應用手冊 Multi-Drop Channel-Link Operation 2004年 10月 4日
應用手冊 CHANNEL LINK Moving and Shaping Information In Point-To-Point Applications 1998年 10月 5日

設計與開發(fā)

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評估板

DS90CR285-86ATQEVM — DS90CR285 和 DS90CR286AT-Q1 通道鏈路 I 串行器/解串器評估模塊

DS90CR285-86ATQEVM 包含發(fā)送器 (Tx) 板、接收器 (Rx) 板和連接電纜。此套件使用戶能夠通過低電壓差分信號 (LVDS) 從測試設備或圖形控制器連接到接收器板。DS90CR285-86ATQEVM 可用于多顯示器應用的性能評估和初始系統(tǒng)原型設計。
用戶指南: PDF
TI.com 上無現(xiàn)貨
評估板

FLINK3V8BT-85 — 用于 FPD 鏈接系列串行器和解串器 LVDS 器件的評估套件

FPD-Link evaluation kit contains a Transmitter (Tx) board, a Receiver (Rx) board along with interfacing cables. This kit will demonstrate the chipsets interfacing from test equipment or a graphics controller using Low Voltage Differential Signaling (LVDS) to a receiver board.

The Transmitter board (...)

用戶指南: PDF
TI.com 上無現(xiàn)貨
仿真模型

DS90CR285 IBIS Model

SNLM037.ZIP (4 KB) - IBIS Model
模擬工具

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模擬工具

TINA-TI — 基于 SPICE 的模擬仿真程序

TINA-TI 提供了 SPICE 所有的傳統(tǒng)直流、瞬態(tài)和頻域分析以及更多。TINA 具有廣泛的后處理功能,允許您按照希望的方式設置結果的格式。虛擬儀器允許您選擇輸入波形、探針電路節(jié)點電壓和波形。TINA 的原理圖捕獲非常直觀 - 真正的“快速入門”。

TINA-TI 安裝需要大約 500MB。直接安裝,如果想卸載也很容易。我們相信您肯定會愛不釋手。

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需要 HSpice (...)

用戶指南: PDF
英語版 (Rev.A): PDF
封裝 引腳 CAD 符號、封裝和 3D 模型
TSSOP (DGG) 56 Ultra Librarian

訂購和質(zhì)量

包含信息:
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息:
  • 制造廠地點
  • 封裝廠地點

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