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LP2997

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DDR-II 終止穩(wěn)壓器

產(chǎn)品詳情

Product type DDR Vin (min) (V) 1.8 Vin (max) (V) 5.5 Vout (min) (V) 0.822 Vout (max) (V) 0.887 Features Shutdown Pin for S3 Rating Catalog Operating temperature range (°C) 0 to 125 Iq (typ) (mA) 0.32 DDR memory type DDR2
Product type DDR Vin (min) (V) 1.8 Vin (max) (V) 5.5 Vout (min) (V) 0.822 Vout (max) (V) 0.887 Features Shutdown Pin for S3 Rating Catalog Operating temperature range (°C) 0 to 125 Iq (typ) (mA) 0.32 DDR memory type DDR2
HSOIC (DDA) 8 29.4 mm2 4.9 x 6 SOIC (D) 8 29.4 mm2 4.9 x 6
  • Source and Sink Current
  • Low Output Voltage Offset
  • No External Resistors Required
  • Linear Topology
  • Suspend to Ram (STR) Functionality
  • Low External Component Count
  • Thermal Shutdown
  • Available in SOIC-8, SO PowerPAD-8 Packages

All trademarks are the property of their respective owners.

  • Source and Sink Current
  • Low Output Voltage Offset
  • No External Resistors Required
  • Linear Topology
  • Suspend to Ram (STR) Functionality
  • Low External Component Count
  • Thermal Shutdown
  • Available in SOIC-8, SO PowerPAD-8 Packages

All trademarks are the property of their respective owners.

The LP2997 linear regulator is designed to meet the JEDEC SSTL-18 specifications for termination of DDR-II memory. The device contains a high-speed operational amplifier to provide excellent response to load transients. The output stage prevents shoot through while delivering 500mA continuous current and transient peaks up to 900mA in the application as required for DDR-II SDRAM termination. The LP2997 also incorporates a VSENSE pin to provide superior load regulation and a VREF output as a reference for the chipset and DIMMs.

An additional feature found on the LP2997 is an active low shutdown (SD) pin that provides Suspend To RAM (STR) functionality. When SD is pulled low the VTT output will tri-state providing a high impedance output, but, VREF will remain active. A power savings advantage can be obtained in this mode through lower quiescent current.

The LP2997 linear regulator is designed to meet the JEDEC SSTL-18 specifications for termination of DDR-II memory. The device contains a high-speed operational amplifier to provide excellent response to load transients. The output stage prevents shoot through while delivering 500mA continuous current and transient peaks up to 900mA in the application as required for DDR-II SDRAM termination. The LP2997 also incorporates a VSENSE pin to provide superior load regulation and a VREF output as a reference for the chipset and DIMMs.

An additional feature found on the LP2997 is an active low shutdown (SD) pin that provides Suspend To RAM (STR) functionality. When SD is pulled low the VTT output will tri-state providing a high impedance output, but, VREF will remain active. A power savings advantage can be obtained in this mode through lower quiescent current.
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LP2996-N 正在供貨 具有 DDR2 關(guān)斷引腳的 1.5A DDR 終端穩(wěn)壓器 DDR-I And DDR-II Linear Termination Regulator

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頂層文檔 類型 標(biāo)題 格式選項 下載最新的英語版本 日期
* 數(shù)據(jù)表 LP2997 DDR-II Termination Regulator 數(shù)據(jù)表 (Rev. F) 2013年 4月 4日
應(yīng)用手冊 Limiting DDR Termination Regulators’ Inrush Current 2016年 8月 23日
應(yīng)用手冊 AN-1254 DDR-SDRAM Termination Simplified Using a Linear Regulator (Rev. A) 2013年 5月 6日

設(shè)計與開發(fā)

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仿真模型

LP2997 PSpice Transient Model

SNVMAH7.ZIP (70 KB) - PSpice Model
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仿真模型

LP2997 Unencrypted PSpice Transient Model

SNVMAH8.ZIP (4 KB) - PSpice Model
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參考設(shè)計

TIDA-010011 — 適用于保護繼電器處理器模塊的高效電源架構(gòu)參考設(shè)計

該參考設(shè)計展示了各種電源架構(gòu)，這些架構(gòu)可為需要 >1A 負載電流和高效率的應(yīng)用處理器模塊生成多個電壓軌。所需的電源通過來自背板的 5V、12V 或 24V 直流輸入生成。電源通過帶集成 FET 的直流/直流轉(zhuǎn)換器生成并且使用帶集成電感器的電源模塊以減小尺寸。此設(shè)計采用 HotRod? 封裝類型，適用于需要低 EMI 的應(yīng)用，也非常適合設(shè)計時間受限的應(yīng)用。其他功能包括 DDR 端接穩(wěn)壓器、輸入電源 OR-ing、電壓時序控制、過載保護電子保險絲以及電壓和負載電流監(jiān)控。該設(shè)計可以用于處理器、數(shù)字信號處理器和現(xiàn)場可編程門陣列。該設(shè)計已依照 CISPR22 標(biāo)準(zhǔn)針對輻射發(fā)射進行了測試，符合 A (...)
原理圖: PDF
封裝 引腳 CAD 符號、封裝和 3D 模型
HSOIC (DDA) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian

訂購和質(zhì)量

包含信息：
  • RoHS
  • REACH
  • 器件標(biāo)識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息：
  • 制造廠地點
  • 封裝廠地點

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