SN65LVDS051
- Meets or Exceeds the Requirements of ANSI
TIA/EIA-644-1995 Standard - Full-Duplex Signaling Rates up to 150 Mbps
- Bus-Pin ESD Exceeds 12 kV
- Operates From a Single 3.3-V Supply
- Low-Voltage Differential Signaling With Typical
Output Voltages of 350 mV and a 100-Ω Load - Propagation Delay Times
- Driver: 1.7 ns Typical
- Receiver: 3.7 ns Typical
- Power Dissipation at 200 MHz
- Driver: 25 mW Typical
- Receiver: 60 mW Typical
- LVTTL Input Levels Are 5-V Tolerant
- Receiver Maintains High Input Impedance With
VCC < 1.5 V - Receiver Has Open-Circuit Fail Safe
The SN65LVDS179, SN65LVDS180, SN65LVDS050, and SN65LVDS051 devices are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 400 Mbps. The TIA/EIA-644 standard-compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a 100-Ω load and receipt of 100-mV signals with up to 1 V of ground potential difference between a transmitter and receiver.
These devices offer various driver, receiver, and enabling combinations in industry-standard footprints. Because these devices are intended for use in simplex or distributed simplex bus structures, the driver enable function does not put the differential outputs into a high-impedance state but rather disconnects the input and reduces the quiescent power used by the device. For these functions with a high-impedance driver output, see the SN65LVDM series of devices. All devices are characterized for operation from –40°C to 85°C.
您可能感興趣的相似產(chǎn)品
功能與比較器件相同,且具有相同引腳
技術(shù)文檔
| 頂層文檔 | 類(lèi)型 | 標(biāo)題 | 格式選項(xiàng) | 下載最新的英語(yǔ)版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | SN65LVDSxxx High-Speed Differential Line Drivers and Receivers 數(shù)據(jù)表 (Rev. R) | PDF | HTML | 2016年 1月 22日 | ||
| 應(yīng)用手冊(cè) | 低壓差分信號(hào) (LVDS) 在 LED 燈墻中的應(yīng)用 | 英語(yǔ)版 | 2022年 5月 19日 | |||
| 應(yīng)用手冊(cè) | Applications of Low-Voltage Differential Signaling (LVDS) in Ultrasound Scanners | 2019年 6月 29日 | ||||
| 應(yīng)用簡(jiǎn)報(bào) | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||||
| 應(yīng)用簡(jiǎn)報(bào) | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||||
| 應(yīng)用簡(jiǎn)報(bào) | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 |
設(shè)計(jì)與開(kāi)發(fā)
如需其他信息或資源,請(qǐng)點(diǎn)擊以下任一標(biāo)題進(jìn)入詳情頁(yè)面查看(如有)。
PSPICE-FOR-TI — PSpice? for TI 設(shè)計(jì)和仿真工具
借助?PSpice for TI 的設(shè)計(jì)和仿真環(huán)境及其內(nèi)置的模型庫(kù),您可對(duì)復(fù)雜的混合信號(hào)設(shè)計(jì)進(jìn)行仿真。創(chuàng)建完整的終端設(shè)備設(shè)計(jì)和原型解決方案,然后再進(jìn)行布局和制造,可縮短產(chǎn)品上市時(shí)間并降低開(kāi)發(fā)成本。?
在?PSpice for TI 設(shè)計(jì)和仿真工具中,您可以搜索 TI (...)
TINA-TI — 基于 SPICE 的模擬仿真程序
TINA-TI 安裝需要大約 500MB。直接安裝,如果想卸載也很容易。我們相信您肯定會(huì)愛(ài)不釋手。
TINA 是德州儀器 (TI) 專(zhuān)有的 DesignSoft 產(chǎn)品。該免費(fèi)版本具有完整的功能,但不支持完整版 TINA 所提供的某些其他功能。
如需獲取可用 TINA-TI 模型的完整列表,請(qǐng)參閱:SpiceRack - 完整列表
需要 HSpice (...)
| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| SOIC (D) | 16 | Ultra Librarian |
| TSSOP (PW) | 16 | Ultra Librarian |
訂購(gòu)和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測(cè)
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)
推薦產(chǎn)品可能包含與 TI 此產(chǎn)品相關(guān)的參數(shù)、評(píng)估模塊或參考設(shè)計(jì)。