SN74AUP1G17-EP

正在供貨

具有施密特觸發(fā)輸入的增強(qiáng)型產(chǎn)品單路 0.8V 至 3.6V 低功耗緩沖器

產(chǎn)品詳情

Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 IOL (max) (mA) 4 Supply current (max) (μA) 0.9 IOH (max) (mA) -4 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 IOL (max) (mA) 4 Supply current (max) (μA) 0.9 IOH (max) (mA) -4 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SOT-SC70 (DCK) 5 4.2 mm2 2 x 2.1
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Available in the Texas Instruments NanoStar? and NanoFree? Packages
  • Low Static-Power Consumption (ICC = 0.9 μA Max)
  • Low Dynamic-Power Consumption (Cpd = 4.4 pF Typ at 3.3 V)
  • Low Input Capacitance (CI = 1.5 pF)
  • Low Noise — Overshoot and Undershoot <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Includes Schmitt-Trigger Inputs
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5.1 ns Max at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • ESD Protection Exceeds 5000 V With Human-Body Model

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

NanoStar, NanoFree are trademarks of Texas Instruments.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Available in the Texas Instruments NanoStar? and NanoFree? Packages
  • Low Static-Power Consumption (ICC = 0.9 μA Max)
  • Low Dynamic-Power Consumption (Cpd = 4.4 pF Typ at 3.3 V)
  • Low Input Capacitance (CI = 1.5 pF)
  • Low Noise — Overshoot and Undershoot <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Includes Schmitt-Trigger Inputs
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5.1 ns Max at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • ESD Protection Exceeds 5000 V With Human-Body Model

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

NanoStar, NanoFree are trademarks of Texas Instruments.

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity.

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching noise immunity at the input.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity.

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching noise immunity at the input.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
下載 觀看帶字幕的視頻 視頻

技術(shù)文檔

star =有關(guān)此產(chǎn)品的 TI 精選熱門(mén)文檔
未找到結(jié)果。請(qǐng)清除搜索并重試。
查看全部 10
頂層文檔 類型 標(biāo)題 格式選項(xiàng) 下載最新的英語(yǔ)版本 日期
* 數(shù)據(jù)表 SN74AUP1G17-EP 數(shù)據(jù)表 2007年 1月 31日
* VID SN74AUP1G17-EP VID V6207623 2016年 6月 21日
* 輻射與可靠性報(bào)告 SN74AUP1G17MDCKREP Reliabilty Report 2016年 2月 9日
選擇指南 Logic Guide (Rev. AC) PDF | HTML 2025年 11月 13日
應(yīng)用簡(jiǎn)報(bào) 了解施密特觸發(fā)器 (Rev. B) PDF | HTML 英語(yǔ)版 (Rev.B) PDF | HTML 2025年 5月 5日
選擇指南 Little Logic Guide 2018 (Rev. G) 2018年 7月 6日
應(yīng)用手冊(cè) How to Select Little Logic (Rev. A) 2016年 7月 26日
選擇指南 邏輯器件指南 2014 (Rev. AA) 最新英語(yǔ)版本 (Rev.AC) PDF | HTML 2014年 11月 17日
選擇指南 小尺寸邏輯器件指南 (Rev. E) 最新英語(yǔ)版本 (Rev.G) 2012年 7月 16日
應(yīng)用手冊(cè) Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

設(shè)計(jì)與開(kāi)發(fā)

如需其他信息或資源，請(qǐng)點(diǎn)擊以下任一標(biāo)題進(jìn)入詳情頁(yè)面查看（如有）。

封裝 引腳 CAD 符號(hào)、封裝和 3D 模型
SOT-SC70 (DCK) 5 Ultra Librarian

訂購(gòu)和質(zhì)量

包含信息：
  • RoHS
  • REACH
  • 器件標(biāo)識(shí)
  • 引腳鍍層/焊球材料
  • MSL 等級(jí)/回流焊峰值溫度
  • MTBF/時(shí)基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測(cè)
包含信息：
  • 制造廠地點(diǎn)
  • 封裝廠地點(diǎn)

支持和培訓(xùn)

可獲得 TI 工程師技術(shù)支持的 TI E2E? 論壇

所有內(nèi)容均由 TI 和社區(qū)貢獻(xiàn)者按“原樣”提供，并不構(gòu)成 TI 規(guī)范。請(qǐng)參閱使用條款。

如果您對(duì)質(zhì)量、包裝或訂購(gòu) TI 產(chǎn)品有疑問(wèn)，請(qǐng)參閱 TI 支持。??????????????

視頻