SN74LVTH16373-EP

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具有三態(tài)輸出的 3.3V Abt 16 位透明 D 級鎖存器(增強(qiáng)型產(chǎn)品)

產(chǎn)品詳情

Number of channels 16 Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 160 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (μA) 5000 Features Bus-hold, Flow-through pinout, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating HiRel Enhanced Product
Number of channels 16 Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 160 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (μA) 5000 Features Bus-hold, Flow-through pinout, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating HiRel Enhanced Product
SSOP (DL) 48 164.358 mm2 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm2 12.5 x 8.1
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources
    (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Member of the Texas Instruments Widebus? Family
  • State-of-the-Art Advanced BiCMOS Technology
    (ABT) Design for 3.3-V Operation and Low Static-
    Power Dissipation
  • Supports Mixed-Mode Signal Operation (5-V Input
    and Output Voltages With 3.3-V VCC)
  • Supports Unregulated Battery Operation Down to
    2.7 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V
    at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up Tri-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for
    External Pullup/Pulldown Resistors
  • Distributed VCC and GND Pins Minimize High-
    Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per
    JESD 17
  • ESD Protection Exceeds JESD 22
    • 4000-V Human Body Model (A114-A)
    • 200-V Machine Model (A115-A)
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources
    (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Member of the Texas Instruments Widebus? Family
  • State-of-the-Art Advanced BiCMOS Technology
    (ABT) Design for 3.3-V Operation and Low Static-
    Power Dissipation
  • Supports Mixed-Mode Signal Operation (5-V Input
    and Output Voltages With 3.3-V VCC)
  • Supports Unregulated Battery Operation Down to
    2.7 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V
    at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up Tri-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for
    External Pullup/Pulldown Resistors
  • Distributed VCC and GND Pins Minimize High-
    Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per
    JESD 17
  • ESD Protection Exceeds JESD 22
    • 4000-V Human Body Model (A114-A)
    • 200-V Machine Model (A115-A)

The SN74LVTH16373 is a 16-bit transparent D-type latch with tri-state outputs designed for low-voltage (3.3 V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. This device can be used as two 8-bit latches or one 16-bit latch. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs.

The SN74LVTH16373 is a 16-bit transparent D-type latch with tri-state outputs designed for low-voltage (3.3 V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. This device can be used as two 8-bit latches or one 16-bit latch. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs.

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頂層文檔 類型 標(biāo)題 格式選項(xiàng) 下載最新的英語版本 日期
* 數(shù)據(jù)表 SN74LVTH16373-EP 3.3-V ABT 16-Bit Transparent D-Type Latch With Tri-State Outputs 數(shù)據(jù)表 (Rev. B) PDF | HTML 2016年 6月 29日
* VID SN74LVTH16373-EP VID V6204712 2016年 6月 21日
選擇指南 Logic Guide (Rev. AC) PDF | HTML 2025年 11月 13日
應(yīng)用手冊 慢速或浮點(diǎn) CMOS 輸入的影響 (Rev. E) PDF | HTML 英語版 (Rev.E) 2025年 3月 26日
應(yīng)用手冊 Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
應(yīng)用手冊 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
選擇指南 邏輯器件指南 2014 (Rev. AA) 最新英語版本 (Rev.AC) PDF | HTML 2014年 11月 17日
選擇指南 《高級總線接口邏輯器件選擇指南》 英語版 2010年 7月 7日
用戶指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
應(yīng)用手冊 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
應(yīng)用手冊 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
應(yīng)用手冊 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002年 5月 22日
應(yīng)用手冊 Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
應(yīng)用手冊 LVT-to-LVTH Conversion 1998年 12月 8日
應(yīng)用手冊 LVT Family Characteristics (Rev. A) 1998年 3月 1日
應(yīng)用手冊 Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
應(yīng)用手冊 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
應(yīng)用手冊 Live Insertion 1996年 10月 1日
應(yīng)用手冊 Understanding Advanced Bus-Interface Products Design Guide 1996年 5月 1日

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仿真模型

SN74LVTH16373 IBIS Model (Rev. C)

SCEM076C.ZIP (32 KB) - IBIS Model
封裝 引腳 CAD 符號、封裝和 3D 模型
SSOP (DL) 48 Ultra Librarian
TSSOP (DGG) 48 Ultra Librarian

訂購和質(zhì)量

包含信息:
  • RoHS
  • REACH
  • 器件標(biāo)識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息:
  • 制造廠地點(diǎn)
  • 封裝廠地點(diǎn)

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