數(shù)據(jù)表
TMP106
- TWO ADDRESSES
- DIGITAL OUTPUT: Two-Wire Serial Interface
- RESOLUTION: 9- to 12-Bits, User-Selectable
- ACCURACY:
- ±2.0°C (max) from -25°C to +85°C
- ±3.07deg;C (max) from -40°C to +125°C
- LOW QUIESCENT CURRENT: 50μA, 0.1μA Standby
- NO POWER-UP SEQUENCE REQUIRED, I2C PULLUPS CAN BE ENABLED PRIOR TO V+
- APPLICATIONS
- NOTEBOOK COMPUTERS
- COMPUTER PERIPHERAL THERMAL PROTECTION
- CELL PHONES
- BATTERY MANAGEMENT
- THERMOSTAT CONTROLS
- ENVIRONMENTAL MONITORING AND HVAC
All trademarks are the property of their respective owners.
The TMP106 is a two-wire, serial output temperature sensor available in a WCSP package. Requiring no external components, the TMP106 is capable of reading temperatures with a resolution of 0.0625°C.
The TMP106 features a Two-Wire interface that is SMBus-compatible, with the TMP106 allowing up to two devices on one bus. The TMP106 also features an SMBus Alert function.
The TMP106 is ideal for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications.
技術(shù)文檔
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查看全部 1 | 頂層文檔 | 類型 | 標(biāo)題 | 格式選項(xiàng) | 下載最新的英語(yǔ)版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | Digital Temperature Sensor With a Two-Wire Interface 數(shù)據(jù)表 (Rev. A) | 2006年 1月 16日 |
設(shè)計(jì)與開發(fā)
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參考設(shè)計(jì)
TIDM-RF-SENSORNODE — 用于 6LoWPAN 和 2.4 GHz 應(yīng)用的 RF 傳感器節(jié)點(diǎn)開發(fā)平臺(tái)
射頻傳感器節(jié)點(diǎn)平臺(tái)旨在用作 6LoWPAN 和 2.4 GHz 應(yīng)用的微型開發(fā)平臺(tái)。此平臺(tái)有三種板載傳感器,其中包括一個(gè) 3 軸加速器、一個(gè)溫度傳感器和兩個(gè)光傳感器。射頻傳感器節(jié)點(diǎn)平臺(tái)可作為獨(dú)立傳感器節(jié)點(diǎn),也可與 PLC(電力線通信)板或射頻接口板配對(duì)形成混合節(jié)點(diǎn)。射頻節(jié)點(diǎn)支持 2.4GHz 射頻協(xié)議,其中包括 6LoWPAN 或 ZigBee?。由于節(jié)點(diǎn)之間的鏈路可以是有線和/或無線的,因此混合網(wǎng)絡(luò)可以提供比傳統(tǒng)節(jié)點(diǎn)更優(yōu)的可靠性和抗噪聲能力。
| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| DSBGA (YZC) | 6 | Ultra Librarian |
訂購(gòu)和質(zhì)量
包含信息:
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測(cè)
包含信息:
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)