TPA301

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350mW 單聲道 AB 類音頻放大器

產(chǎn)品詳情

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.35 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 1 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.35 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 1 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm2 3 x 4.9 SOIC (D) 8 29.4 mm2 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultra-Low Quiescent Current in Shutdown Mode...0.15 μA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD? MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultra-Low Quiescent Current in Shutdown Mode...0.15 μA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD? MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
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* 數(shù)據(jù)表 TPA301: 350-mW Mono Audio Power Amplifier 數(shù)據(jù)表 (Rev. E) 2004年 6月 24日
應(yīng)用手冊(cè) PowerPAD? Thermally Enhanced Package (Rev. H) 2018年 7月 6日
用戶指南 TPA301EVM - User Guide (Rev. A) 2001年 4月 17日

設(shè)計(jì)與開發(fā)

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評(píng)估板

TPA301EVM — TPA301 評(píng)估模塊 (EVM)

A low-voltage bridge-tied load (BTL) audio power amplifier capable of delivering 350-mW to the load. It is characterized at 3.3-V and 5-V, but will operate from 2-V to 5.5-V. To minimize power consumption, this device features a shutdown mode, holding IDD <0.15 µA. Package: 8-pin SOIC.

用戶指南: PDF
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子卡

BOOSTXL-AUDIO — 音頻信號(hào)處理 BoosterPack 插件模塊

插入 LaunchPad? 開發(fā)套件時(shí)，BOOSTXL-AUDIO Audio BoosterPack? 插件模塊可從麥克風(fēng)采集音頻輸入并通過板載揚(yáng)聲器輸出音頻。也支持耳機(jī)輸入和輸出。這種音頻輸入/輸出流讓開發(fā)人員能夠?qū)﹄S附 LaunchPad 開發(fā)套件上微控制器 (MCU) 的數(shù)字信號(hào)處理 (DSP) 和濾波功能進(jìn)行實(shí)驗(yàn)。

可通過多種方案（可通過 BoosterPack 上的跳線進(jìn)行選擇）將揚(yáng)聲器連接到 LaunchPad 的 MCU：(1) 通過 SPI 將音頻數(shù)據(jù)輸出到音頻 BoosterPack 上提供的 SPI DAC；(2) 直接連接到 LaunchPad MCU 上的 (...)

用戶指南: PDF
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仿真模型

TPA301 PSpice Model

SLOM361.ZIP (21 KB) - PSpice Model
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參考設(shè)計(jì)

TIDM-VOICEBANDAUDIO — 采用 PWM DAC 的語(yǔ)音頻帶音頻回放

此設(shè)計(jì)為低成本音頻輸出，基于生成 PWM 的計(jì)時(shí)器以及帶放大器級(jí)的外部低通濾波器，適用于耳機(jī)或揚(yáng)聲器。音頻數(shù)據(jù)存儲(chǔ)在板載 SPI 閃存中。此設(shè)計(jì)提供含 Launchpad 直通代碼的 PC GUI，用于向 SPI 閃存中加載音頻數(shù)據(jù)。
設(shè)計(jì)指南: PDF
原理圖: PDF
封裝 引腳 CAD 符號(hào)、封裝和 3D 模型
HVSSOP (DGN) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian

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  • 器件標(biāo)識(shí)
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  • MSL 等級(jí)/回流焊峰值溫度
  • MTBF/時(shí)基故障估算
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  • 持續(xù)可靠性監(jiān)測(cè)
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