可提供此產(chǎn)品的更新版本
功能與比較器件相似
TPS8268120
- Wide VIN Range From 2.5V to 5.5V
- Total Solution Size < 6.7 mm2
- Sub 1-mm Profile Solution
- ±1.5% DC Voltage Accuracy
- Up to 1600-mA Load Current
- Up to 90% Efficiency
- Fixed Output Voltage:
- TPS8268180: 1.80V
- TPS8268150: 1.50V
- TPS8268120: 1.20V
- TPS8268105: 1.05V
- TPS8268090: 0.90V
- Low EMI by Spread Spectrum PWM Frequency
Dithering - Best in Class Load and Line Transient Response
- Internal Soft Start
- Current Overload and Thermal Shutdown Protection
The TPS8268x device is a complete DC/DC step-down power supply optimized for small solution size. Included in the package are the switching regulator, inductor and input/output capacitors. Integration of all passive components enables a tiny solution size of only 6.7mm2.
The TPS8268x is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications in which high load currents in a very small solution size and height are required. The TPS8268x is optimized for high efficiency and low output voltage ripple and supports up to 1600-mA load current. With an input voltage range of 2.5-V to 5.5-V, the device supports applications powered by Li-Ion batteries as well as 5-V and 3.3-V rails.
The TPS8268x operates at a 5.5-MHz switching frequency with spread spectrum capability. For noise-sensitive applications, this provides a lower noise regulated output, as well as low noise at the input. The device supports a fixed output voltage, requiring no external feedback network.
These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency with the same size.
The TPS8268x is packaged in a compact (2.3mm × 2.9mm) and low profile BGA package suitable for automated assembly by standard surface mount equipment.
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技術(shù)文檔
| 頂層文檔 | 類型 | 標(biāo)題 | 格式選項(xiàng) | 下載最新的英語版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | TPS8268x 1600-mA High-Efficiency MicroSiP Step-Down Converter Module (Profile < 1.0mm) 數(shù)據(jù)表 (Rev. C) | PDF | HTML | 2015年 6月 22日 | ||
| 用戶指南 | Manufacturing and Rework Design Guide for MicroSiP? Power Modules (Rev. A) | PDF | HTML | 2021年 6月 16日 | |||
| 模擬設(shè)計(jì)期刊 | Understanding 100% mode in low-power DC/DC converters | 2018年 6月 22日 | ||||
| 模擬設(shè)計(jì)期刊 | Testing tips for applying external power to supply outputs without an input voltage | 2016年 10月 24日 | ||||
| 白皮書 | SiP Power Modules White Paper | 2016年 1月 26日 |
設(shè)計(jì)與開發(fā)
如需其他信息或資源,請(qǐng)點(diǎn)擊以下任一標(biāo)題進(jìn)入詳情頁面查看(如有)。
| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| USIP (SIP) | 9 | Ultra Librarian |
訂購和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測(cè)
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)
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