TS5A26542
- Specified Break-Before-Make Switching
- Low ON-State Resistance (0.75
Max) - Control Inputs Reference to VIO
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion (THD)
- 2.25-V to 5.5-V Power Supply (V+)
- 1.65-V to 1.95-V Logic Supply (VIO)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 300-V Machine Model (A115-A)
- 2000-V Human-Body Model
- COM Inputs
- 8000-V Human-Body Model
(A114-B, Class II) - ±15-kV Contact Discharge (IEC 61000-4-2)
- 8000-V Human-Body Model
- APPLICATIONS
- Cell Phones
- PDAs
- Portable Instrumentation
NanoFree Is a trademark of Texas Instruments
The TS5A26542 is a dual single-pole double-throw (SPDT) analog switch that is designed to operate from 2.25 V to 5.5 V. The device offers a low ON-state resistance with an excellent channel-to-channel ON-state resistance matching, and the break-before-make feature to prevent signal distortion during the transferring of a signal from one path to the another. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.
The TS5A26542 has a separate logic supply pin (VIO) that operates from 1.65 V to 1.95 V. VIO powers the control circuitry, which allows the TS5A26542 to be controlled by 1.8-V signals.
技術(shù)文檔
| 頂層文檔 | 類型 | 標題 | 格式選項 | 下載最新的英語版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | 0.75-Ohm Dual SPDT Analog Switch With Input Logic Translation 數(shù)據(jù)表 (Rev. E) | 2009年 12月 16日 | |||
| 應(yīng)用手冊 | 選擇正確的德州儀器 (TI) 信號開關(guān) (Rev. E) | PDF | HTML | 英語版 (Rev.E) | PDF | HTML | 2022年 8月 5日 | |
| 應(yīng)用手冊 | 多路復(fù)用器和信號開關(guān)詞匯表 (Rev. B) | 英語版 (Rev.B) | PDF | HTML | 2022年 3月 11日 | ||
| 應(yīng)用手冊 | 防止模擬開關(guān)的額外功耗 | 英語版 | 2008年 7月 15日 | |||
| 應(yīng)用手冊 | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設(shè)計與開發(fā)
如需其他信息或資源,請點擊以下任一標題進入詳情頁面查看(如有)。
| 封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
|---|---|---|
| DSBGA (YZT) | 12 | Ultra Librarian |
訂購和質(zhì)量
- RoHS
- REACH
- 器件標識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測
- 制造廠地點
- 封裝廠地點
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