ZHCSSA7 october 2020 BQ25302
PRODUCTION DATA
| THERMAL METRIC | DEVICE | UNIT | |
|---|---|---|---|
| RθJA | Junction-to-ambient thermal resistance (JEDEC(1)) | 45.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 48.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 19.0 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 19.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 7.9 | °C/W |