ZHCSOH3B July   2021  – May 2022 DLP300S

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說明
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5. 6.5  Thermal Information
   6. 6.6  Electrical Characteristics
   7. 6.7  Timing Requirements
   8. 6.8  Switching Characteristics
   9. 6.9  System Mounting Interface Loads
   10. 6.10 Micromirror Array Physical Characteristics
   11. 6.11 Micromirror Array Optical Characteristics
   12. 6.12 Window Characteristics
   13. 6.13 Chipset Component Usage Specification
   14. 6.14 Software Requirements
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
   4. 7.4 Device Functional Modes
   5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Optical Interface and System Image Quality
         1. 7.5.1.1 Numerical Aperture and Stray Light Control
         2. 7.5.1.2 Pupil Match
         3. 7.5.1.3 Illumination Overfill
   6. 7.6 Micromirror Array Temperature Calculation
   7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On and Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
9. 9 Power Supply Recommendations
   1. 9.1 DMD Power Supply Power-Up Procedure
   2. 9.2 DMD Power Supply Power-Down Procedure
   3. 9.3 Power Supply Sequencing Requirements
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
11. 11Device and Documentation Support
    1. 11.1 Device Support
       1. 11.1.1 第三方產(chǎn)品免責(zé)聲明
       2. 11.1.2 Device Nomenclature
       3. 11.1.3 Device Markings
    2. 11.2 接收文檔更新通知
    3. 11.3 Related Links
    4. 11.4 支持資源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 術(shù)語表
12. 12Mechanical, Packaging, and Orderable Information