4 Revision History
Changes from Revision G (May 2016) to Revision H (March 2022)
- 更新了整個(gè)文檔中的表格、圖和交叉參考的編號(hào)格式Go
- Added row in Pin function table for thermal padGo
- Added sentence to end of first paragraph that recommends soldering package
thermal pad to PCB in order to minimize stress on peripheral pinsGo
Changes from Revision F (February 2015) to Revision G (May 2016)
- Added tWL(PDL_MIN) and tDEL to the
Section 7.7
table Go
Changes from Revision E (July 2013) to Revision F (February 2015)
- 添加了引腳配置和功能 部分、ESD 等級(jí) 表、特性說明 部分、器件功能模式、應(yīng)用和實(shí)施 部分、電源相關(guān)建議 部分、布局 部分、器件和文檔支持 部分以及機(jī)械、封裝和可訂購(gòu)信息 部分Go