ZHCSNY4A November 2021 – March 2022 THS4541-DIE
PRODUCTION DATA
| 芯片厚度 | 背面光潔度 | 背面電勢 | 接合焊盤金屬化 | 接合焊盤尺寸 (X x Y) |
|---|---|---|---|---|
| 15 密耳 (381μm) | 硅片減薄 | 晶圓背面與有源電路進(jìn)行電氣隔離 | 鋁銅 | 85.0μm × 85.0μm |
圖 5-1 THS4541-DIE 24 焊盤裸片圖| 焊盤號碼 | 焊盤名稱 | X 最小值 | Y 最小值 | X 最大值 | Y 最大值 |
|---|---|---|---|---|---|
| 1 | DNC(1) | 4.50 | 686.50 | 89.50 | 771.50 |
| 2 | IN+ | 4.50 | 590.50 | 89.50 | 675.50 |
| 3 | DNC(1) | 4.50 | 458.50 | 89.50 | 543.50 |
| 4 | DNC(1) | 4.50 | 363.50 | 89.50 | 448.50 |
| 5 | IN- | 4.50 | 231.50 | 89.50 | 316.50 |
| 6 | DNC(1) | 4.50 | 135.50 | 89.50 | 220.50 |
| 7 | VOCM | 283.85 | 4.50 | 368.85 | 89.50 |
| 8 | DNC(1) | 378.85 | 4.50 | 463.85 | 89.50 |
| 9 | VS+ | 473.85 | 4.50 | 558.85 | 89.50 |
| 10 | DNC(1) | 568.85 | 4.50 | 653.85 | 89.50 |
| 11 | VS+ | 663.85 | 4.50 | 748.85 | 89.50 |
| 12 | DNC(1) | 758.85 | 4.50 | 843.85 | 89.50 |
| 13 | DNC(1) | 1010.50 | 92.65 | 1095.50 | 177.65 |
| 14 | OUT+ | 1010.50 | 188.65 | 1095.50 | 273.65 |
| 15 | DNC(1) | 1010.50 | 363.50 | 1095.50 | 448.50 |
| 16 | DNC(1) | 1010.50 | 458.50 | 1095.50 | 543.50 |
| 17 | OUT- | 1010.50 | 633.35 | 1095.50 | 718.35 |
| 18 | DNC(1) | 1010.50 | 729.35 | 1095.50 | 814.35 |
| 19 | DNC(1) | 758.85 | 817.50 | 843.85 | 902.50 |
| 20 | VS- | 663.85 | 817.50 | 748.85 | 902.50 |
| 21 | DNC(1) | 568.85 | 817.50 | 653.85 | 902.50 |
| 22 | VS- | 473.85 | 817.50 | 558.85 | 902.50 |
| 23 | DNC(1) | 378.85 | 817.50 | 463.85 | 902.50 |
| 24 | PD | 283.85 | 817.50 | 368.85 | 902.50 |