ZHCSKD5A October 2019 – August 2020 TPA3139D2
PRODUCTION DATA
| THERMAL METRIC(1) | TPA3139D2 | UNIT | |
|---|---|---|---|
| RGE (QFN) | |||
| 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 37.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 35.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 16.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 16.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 7.3 | °C/W |