10 Revision History
Changes from Revision B (July 2024) to Revision C (October 2024)
- 將特性 要點(diǎn)從 RON = 6ω（最大值）更改為 RON = 6?（最大值）Go
- 將特性 要點(diǎn)從 δrON = 0.2ω（典型值）更改為 ΔrON = 0.2?（典型值）Go
Changes from Revision A (February 2015) to Revision B (July 2024)
- 更新了整個(gè)文檔中的表格、圖和交叉參考的編號(hào)格式Go
- 更新了特性 部分中的 ESD 性能測(cè)試條件Go
- Changed CDM test conditions in the
ESD Ratings table from: per JEDEC specification
JESD22-C101 to: per ANSI/ESDA/JEDEC
JS-002Go
- Added footnote to the VI/O parameter in the
Recommended Operating Conditions tableGo
- Changed RSE (UQFN)
junction-to-ambient thermal resistance value from:
179.7°C/W to: 204.8°C/WGo
- Changed RSE (UQFN)
junction-to-case (top) thermal resistance value
from: 107.9°C/W to: 118.1°C/WGo
- Changed RSE (UQFN)
junction-to-board thermal resistance value from:
100.7°C/W to: 121.5°C/WGo
- Changed RSE (UQFN) junction-to-top
characterization parameter value from: 7.1°C/W to:
13.9°C/WGo
- Changed RSE (UQFN)
junction-to-board characterization parameter value
from: 100.0°C/W to: 121.2°C/WGo
- Changed the VIK value in the Electrical
Characteristics table from: –1.8V maximum to: –1.8V
minimumGo
- Changed the Typical Characteristics sectionGo
Changes from Revision * (November 2008) to Revision A (February 2015)
- 添加了“ESD 等級(jí)”表、“特性說(shuō)明”部分、“器件功能模式”、“應(yīng)用和實(shí)施”部分、“電源相關(guān)建議”部分、“布局”部分、“器件和文檔支持”部分以及“機(jī)械、封裝和可訂購(gòu)信息”部分Go
- 刪除了數(shù)據(jù)表中的訂購(gòu)信息 表。如需了解訂購(gòu)信息，請(qǐng)參閱機(jī)械、封裝和可訂購(gòu)信息 部分Go
- 將文檔按全新 TI 數(shù)據(jù)表標(biāo)準(zhǔn)進(jìn)行了更新Go