SFFSAY5 February 2026 UCC34141-Q1
The failure mode distribution estimation for the UCC34141-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity, and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.
| Die Failure Modes | Failure Mode Distribution (%) |
|---|---|
| VDD or VEE has no power | 65 |
| VDD or VEE accuracy not meeting specification | 23 |
| PG indicates the wrong state | 1 |
| Degraded EMI performance | 10 |
| Degraded testability (no mission impact) | 1 |
The FMD in the Die Failure Modes and Distribution table excludes short-circuit faults across the isolation barrier. Faults for short circuits across the isolation barrier can be excluded according to IEC 61800-5-2:2016 if the following requirements are fulfilled:
Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance.