LMP91200
- Active Guarding
- Key Specifications
Unless otherwise noted, typical values at
TA = 25°C, VS = (VDD-GND) = 3.3 V - pH Buffer Input Bias Current (0 < VINP < 3.3 V)
- Maximum at 25°C: ±125 fA
- Maximum at 85°C: ±445 fA
- pH Buffer Input Bias Current
(–500 mV < VINP– VCM < 500 mV),
VS = (VDD – GND) = 0 V- Maximum at 25°C: ±600 fA
- Maximum at 85°C: ±6.5 pA
- pH Buffer Input Offset Voltage: ±200 μV
- pH Buffer Input Offset Voltage Drift: ±2.5 μV/°C
- Supply Current: 50 μA
- Supply Voltage: 1.8 V to 5.5 V
- Operating Temperature Range: –40°C to 125°C
- Package: 16-Pin TSSOP
The LMP91200 device is a sensor AFE for use in low-power, analytical-sensing applications. The LMP91200 is designed for 2-electrode sensors. This device provides all of the functionality needed to detect changes based on a delta voltage at the sensor. Optimized for low-power applications, the LMP91200 works over a voltage range of 1.8 V to 5.5 V. With its extremely low input bias current it is optimized for use with pH sensors. Also, in absence of supply voltage the very low input bias current reduces degradation of the pH probe when connected to the LMP91200. Two guard pins provide support for high parasitic impedance wiring. Depending on the configuration, total current consumption for the device is 50 µA while measuring pH. Available in a 16-pin TSSOP package, the LMP91200 operates from –40°C to +125°C.
技術(shù)文檔
| 頂層文檔 | 類(lèi)型 | 標(biāo)題 | 格式選項(xiàng) | 下載最新的英語(yǔ)版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | LMP91200 Configurable AFE for Low Power Chemical Sensing Apps 數(shù)據(jù)表 (Rev. E) | 2016年 2月 29日 | |||
| 技術(shù)文章 | What can we learn for IIoT from the man who invented the Web? | PDF | HTML | 2016年 1月 12日 | |||
| 應(yīng)用手冊(cè) | AN-2254 MSP430 Interface to LMP91200 Code Library (Rev. A) | 2013年 5月 1日 | ||||
| 更多文獻(xiàn)資料 | 傳感器模擬前端手冊(cè) | 2012年 10月 30日 |
設(shè)計(jì)與開(kāi)發(fā)
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TIDA-00561 — 無(wú)線 pH 傳感器發(fā)送器(兼容 SensorTag 2.0)參考設(shè)計(jì)
由于 TIDA-00561 外形尺寸和電氣連接與 TI SimpleLink? CC2650 SensorTag 生態(tài)系統(tǒng)兼容,因此只需進(jìn)行簡(jiǎn)單的固件更新,即可選擇無(wú)線連接技術(shù):Bluetooth? 智能、ZigBee? 或 (...)
| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
訂購(gòu)和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測(cè)
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)
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