TS3USB221A-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
- Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C5
- VCC Operation at 2.5 V to 3.3 V
- VI/O Accepts Signals Up to 5.5 V
- 1.8-V Compatible Control-Pin Inputs
- Low-Power Mode When OE Is Disabled (1 μA)
- rON = 16 Ω Maximum
- ΔrON = 0.2 Ω Typical
- Cio(on) = 6 pF Typical
- Low Power Consumption (30 μA Maximum)
- High Bandwidth (900 MHz Typical)
- ESD Performance Tested Per JESD 22
- 7000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 7000-V Human-Body Model
- ESD Performance I/O to GND Per JESD 22
- 12-kV Human-Body Model
The TS3USB221A-Q1 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in automotive USB hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).
The TS3USB221A-Q1 integrates ESD protection cells on all pins, is available in a tiny UQFN package
(2 mm × 1.5 mm) and is characterized over the free air temperature range from –40°C to 125°C.
技術(shù)文檔
| 頂層文檔 | 類型 | 標題 | 格式選項 | 下載最新的英語版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | TS3USB221A-Q1 ESD Protected, High-Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch With Single Enable 數(shù)據(jù)表 (Rev. E) | PDF | HTML | 2020年 6月 22日 | ||
| 功能安全信息 | TS3USB221A-Q1 Functional Safety FIT Rate and FMD (Rev. A) | PDF | HTML | 2025年 7月 28日 | |||
| 應用手冊 | 高速接口布局指南 (Rev. J) | PDF | HTML | 英語版 (Rev.J) | PDF | HTML | 2023年 3月 23日 |
設(shè)計與開發(fā)
如需其他信息或資源,請點擊以下任一標題進入詳情頁面查看(如有)。
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| 封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
|---|---|---|
| UQFN (RSE) | 10 | Ultra Librarian |
訂購和質(zhì)量
- RoHS
- REACH
- 器件標識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測
- 制造廠地點
- 封裝廠地點
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