TS3USB31

正在供貨

具有單使能端的高速 USB 2.0 (480Mbps) 1 端口開關(guān)

產(chǎn)品詳情

Protocols USB 2.0 Configuration 1:1 SPST Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 1220 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 ESD HBM (typ) (kV) 6 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 2 CON (typ) (pF) 6 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (μA) 1 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 Rating Catalog
Protocols USB 2.0 Configuration 1:1 SPST Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 1220 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 ESD HBM (typ) (kV) 6 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 2 CON (typ) (pF) 6 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (μA) 1 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 Rating Catalog
UQFN (RSE) 8 2.25 mm2 1.5 x 1.5
  • VCC Operation at 3 V and 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down Mode Operation
  • ron = 10 Ω Maximum
  • Δron <0.35 Ω Typical
  • Cio(ON) = 6 pF Typical
  • Low Power Consumption (1 μA Maximum)
  • ESD Performance Tested Per JESD 22
    • 6000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • Wide –3-dB Bandwidth = 1220 MHz Typical
  • Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)
  • VCC Operation at 3 V and 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down Mode Operation
  • ron = 10 Ω Maximum
  • Δron <0.35 Ω Typical
  • Cio(ON) = 6 pF Typical
  • Low Power Consumption (1 μA Maximum)
  • ESD Performance Tested Per JESD 22
    • 6000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • Wide –3-dB Bandwidth = 1220 MHz Typical
  • Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)

The TS3USB31 is a 1:1 SPST high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals. This device comes in a small UQFN package for use in a handset or consumer applications, such as cell phones, digital cameras, and notebooks with hubs. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB31 is a 1:1 SPST high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals. This device comes in a small UQFN package for use in a handset or consumer applications, such as cell phones, digital cameras, and notebooks with hubs. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

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* 數(shù)據(jù)表 TS3USB31 1:1 SPST High-Speed USB 2.0 (480-Mbps) Bus Isolation Switch With Single Enable 數(shù)據(jù)表 (Rev. E) PDF | HTML 2016年 8月 25日
應(yīng)用手冊 信號調(diào)節(jié)器和 USB 集線器高速布局指南 (Rev. A) PDF | HTML 英語版 (Rev.A) PDF | HTML 2026年 1月 14日
應(yīng)用手冊 根據(jù)帶寬選擇無源多路復(fù)用器 (Rev. A) PDF | HTML 英語版 (Rev.A) PDF | HTML 2024年 8月 30日

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仿真模型

HSPICE Model for TS3USB31

SCDJ042.ZIP (95 KB) - HSpice Model
仿真模型

TS3USB31 IBIS Model

SCDM099.ZIP (16 KB) - IBIS Model
封裝 引腳 CAD 符號、封裝和 3D 模型
UQFN (RSE) 8 Ultra Librarian

訂購和質(zhì)量

包含信息:
  • RoHS
  • REACH
  • 器件標(biāo)識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息:
  • 制造廠地點
  • 封裝廠地點

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