Reliability????
Dependable by design
Automated results through a reliability-aware design flow
At TI, reliability is more than qualification. For more than a decade, we've made significant innovations in our design process to develop a reliability-aware toolkit. This allows us to integrate reliability with technology models and our product development cycle, which includes design automation, simulation and verification. Reliability simulations incorporate temperature and product lifetime targets, delivering increased reliability coverage for demanding customer applications.
Why choose TI for Reliability?
Industry-leading
We lead with reliability-aware design, benefiting customers. Our advanced software accommodates reliability models and stresses, improving products for the AI era.
Automated
Our evolving design reliability is automated through software tools. Product lifetime targets and temperature are integrated from transistor development to delivery.
Dependable
Our products are verified through extensive simulations, delivering stable electrical performance for demanding applications, including extended automotive and industrial lifecycles.
Reliability signoff
Our design processes utilize a dedicated reliability signoff (RSO), which reflects TI's commitment to product reliability.
TI reliability: Integration with design
In the early phase of technology development and product definition, reliability support is planned.
- Lifetime targets are established, enabling the most demanding customer applications, including extended automotive and industrial product lifecycles.
- Applications are reviewed to confirm technology and design processes can support all intended use cases.
- Temperature range, use cases, and packaging materials are evaluated to confirm margin for robust operation.
- Package Options are assessed to ensure thermal and electrical performance can be supported.
During development, PDK is released, automating reliability verification throughout the design flow.
- Transistor and metal reliability are quantified through extensive accelerated stress testing. Reliability models are developed, identifying wear-out conditions and safe operating area (SOA) limits. These models are ultimately formatted for use in automated design software tools.
- Electrical circuit models (SPICE models) are developed at the transistor level and are validated across process, voltage, and temperature, enabling electrically precise, automated simulations.
- Reliability and electrical models are integrated into the PDK and released for use in simulation and physical design tools. The reliability models automate reliability integration throughout the design flow.
During design, reliability is integrated and verified using automated, reliability-aware tools.
- Extensive circuit simulations are performed to ensure stability and reliability to worst case conditions, which include manufacturing process, voltage, and temperature extremes, and constraints in the physical design.
- The physical design, including package, is verified to ensure power and signal integrity and compliance with design rules.
- Reliability Signoff (RSO) is completed. This signoff process enables execution of advanced reliability simulations, increasing both reliability completeness and coverage in the design cycle and ensuring delivery of robust TI products.
- This reliability-aware design flow advances reliability beyond qualification, delivering consistent performance through product lifetime.
During product validation
- Extensive Product Testing is performed in engineering labs and/or automated testers, to provide comprehensive circuit coverage and validation across manufacturing, temperature, and voltage extremes.
- Performance margin is assessed through "break the device" tests, and device specification limits are determined.
- Qualification is the last step, where product-level accelerated stress tests are executed, consistent with JEDEC and AEC industry standards. We have a rich qualification database of circuits, devices, and packages, that can be deployed to reduce risk, improve customer confidence, and reduce qualification cycle times.
During production
- Yield and Reliability Metrics are monitored to ensure consistent product.
- Production testing utilizes effective margin and defect screening to ensure products incorporate quality and reliability through automated testing.
- Defective Part Per Billion (DPPB) are monitored and driven towards 0 by TI's continuous improvement processes.
- TI products are built to be reliable across various markets. TI products are used in many applications, including extended lifetimes, high temperatures, and extreme conditions.
Explore reliability tools & resources
Frequently asked questions
Quality policies & procedures
TI's quality policies and procedures help quickly address and resolve any quality-related issue that could arise, from new product qualifications and process change notices to timely resolution of customer issues and complaints. For answers to questions about TI's quality management system, general quality guidelines (GQG), quality policy manual, change control and product withdrawal/discontinuance policies, click here.
Environmental information
Our objective is to conduct our business in such a way that protects and preserves the environment, health and safety of our employees, customers and the communities where we live and operate. For common questions about TI's material content, environmental compliance, lead-free and conflict material information, click here.
Qualification
The qualification process confirms that the reliability of our prodcuts, processes and packages meets industry standards. All TI products undergo qualification and reliability testing or qualification by similiarity justification prior to release. Common questions about TI's qualification process can be found here.
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